公开(公告)号：EP3124525A4

公开(公告)日：2017-02-01

申请号：EP15768239

申请日：2015-03-27

申请人： TEIJIN LTD ,  TSUKISHIMA KIKAI CO

发明人： KON TATSUICHIROU ,  EKINAKA TATSUYA ,  KISHIMOTO HIROSHI ,  MORITA YUME ,  SUGA TAKEHIRO ,  OGATA SATOSHI ,  NAKAGOMI MASATO

IPC分类号： C08J7/04 ,  B05D7/00 ,  C08L69/00

CPC分类号： C08J7/045 ,  B05D3/0254 ,  B05D7/52 ,  C08J7/047 ,  C08J7/123 ,  C08J2369/00 ,  C08J2433/08 ,  C08J2483/04 ,  C23C16/02 ,  C23C16/0254 ,  C23C16/0272 ,  C23C16/401 ,  C23C16/402 ,  C23C16/45565 ,  C23C16/45572 ,  C23C16/50 ,  C23C16/5096 ,  C23C16/56 ,  C23C18/122 ,  C23C18/1233 ,  C23C18/1254 ,  H01J37/32091

摘要： The present invention realizes a polymer substrate with hard coating layer comprising a high level of environmental resistance and a high level of abrasion resistance. A polymer substrate with hard coating layer is provided that comprises a polymer substrate (60) having a thickness of 1 mm to 20 mm and a hard coating layer (70,80) on the surface thereof. Here, in this polymer substrate with hard coating layer, the hard coating layer (70,80) is laminated on the surface of the polymer substrate, contains as a main component thereof a hydrolysis-condensation product of an organic silicon compound, has a thickness of 0.1 µm to 20 µm, makes direct contact with a cured underlayer on the opposite side of the polymer substrate, is formed from an organic silicon compound by PE-CVD, and satisfies all of the following requirements (a) to (c): (a) film thickness of the silicon oxide layer is within the range of 3.5 µm to 9.0 µm, (b) maximum indentation depth of the surface of the silicon oxide layer as determined by measuring nanoindentation under conditions of a maximum load of 1 mN is 150 nm or less, and (c) the value of critical compression ratio K of the silicon oxide layer, as defined by formula (1) in a 3-point bending test of the polymer substrate with hard coating layer that imparts indentation displacement in which the surface laminated with the silicon oxide layer becomes concave, is 0.975 or less.