公开(公告)号：EP0889515B1

公开(公告)日：2006-06-28

申请号：EP97912528.3

申请日：1997-11-21

申请人： Taiyo Nippon Sanso Corporation ,  Toda, Masayuki ,  OHMI, Tadahiro

发明人： TODA, Masayuki ,  OHMI, Tadahiro ,  ISHIHARA, Yoshio, Nippon Sanso Corporation

IPC分类号： H01L21/00

CPC分类号： H01L21/67126 ,  H01L21/67724 ,  H01L21/67736

摘要： When a thin sheet-like substrate S is conveyed between conveying chambers (2) equipped with a processing apparatus (1) and kept in an inert gas atmosphere by using a conveying robot (30) equipped with an accommodation chamber (3) capable of accommodating the thin sheet-like substrate (S) in an inert gas atmosphere, a connection chamber (4) is interposed between the accommodation chamber (3) and the conveying chamber (2) when the thin sheet-like substrate (S) is transferred between the accommodation chamber (3) of the conveying robot (30) and the conveying chamber (2) on the side of the processing apparatus (1), and is vacuumized, and then an inert gas is introduced. Thereafter, gate valves (GV1 and GV2) of the accommodation chamber (3) and the conveying chamber (2) are opened and the thin sheet-like substrate (S) is carried in and out.

公开(公告)号：EP0889515A1

公开(公告)日：1999-01-07

申请号：EP97912528.3

申请日：1997-11-21

申请人： NIPPON SANSO CORPORATION ,  Toda, Masayuki ,  OHMI, Tadahiro

发明人： TODA, Masayuki ,  OHMI, Tadahiro ,  ISHIHARA, Yoshio, Nippon Sanso Corporation

IPC分类号： H01L21/68

CPC分类号： H01L21/67126 ,  H01L21/67724 ,  H01L21/67736

摘要： The present invention uses a transportation robot furnished with a storage chamber 3 that can store substrate wafers S under an inert gas atmosphere, and when transporting substrate wafers S between transportation chambers 2 installed on processing apparatus 1 and holding an inert gas atmosphere, connection chamber 4 is disposed between storage chamber 3 and transportation chamber 2 when placing and removing substrate wafers S between storage chamber 3 of transportation robot 30 and the transportation chamber 2 of processing apparatus 1, and after introducing inert gas into the connection chamber 4 at low pressure, opening the gate valves GV1 and GV2 between storage chamber 3 and transportation chamber 2.

摘要翻译： 本发明使用具有可在惰性气体环境下存储基板S的储存室3的输送机器人，并且当在安装在处理装置1上的输送室2和保持惰性气体气氛之间输送基板S时，连接室4 在运送机器人30的储存室3和处理装置1的运送室2之间放置和移除基板晶片S时，在将惰性气体以低压，开放的方式引入连接室4之后，设置在储存室3和输送室2之间 存储室3和运送室2之间的闸阀GV1和GV2。