公开(公告)号：EP2663419A2

公开(公告)日：2013-11-20

申请号：EP12704145.7

申请日：2012-01-11

申请人： Tamarack Scientific Co. Inc.

发明人： SOUTER, Matthew E.

IPC分类号： B23K26/06 ,  B23K26/08 ,  H01L21/768

CPC分类号： B23K26/40 ,  B23K26/06 ,  B23K26/0626 ,  B23K26/0853 ,  B23K26/127 ,  B23K26/142 ,  B23K26/1462 ,  B23K26/364 ,  B23K2203/172 ,  H01L21/76865 ,  H01L21/76871

摘要： A method for making conductive traces and interconnects on a surface of a substrate includes, for an embodiment, forming a dielectric or polymer layer on the surface of the substrate, forming a seed layer of an electrically conductive material on the dielectric or polymer layer, patterning a photoresist on the seed layer, forming the conductive traces on the patterned photoresist and seed layer, removing the photoresist from the substrate, and irradiating the surface of the substrate with a fluence of laser light effective to ablate the seed layer from areas of the substrate surface exclusive of the conductive traces.

摘要翻译： 在衬底表面上制造导电迹线和互连的方法包括在衬底的表面上形成电介质层或聚合物层，在电介质层或聚合物层上形成导电材料种子层，构图 在种子层上的光致抗蚀剂，在图案化的光致抗蚀剂和籽晶层上形成导电迹线，从衬底去除光致抗蚀剂，并用激光能量照射衬底的表面，该激光能有效地从衬底的区域烧蚀晶种层 表面排除导电迹线。