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公开(公告)号：EP3434377A1
公开(公告)日：2019-01-30
申请号：EP17770178.6
申请日：2017-03-17
发明人： HIRANO, Masaki
摘要： The present invention provides a spray nozzle, a film forming device, and a film forming method, each of which facilitates formation of a film in a small region. A spray nozzle (1) includes: a gas entrance section (2) in which a passage of a carrier gas gradually becomes smaller along a flow of the carrier gas; a passage enlargement section (3) in which a passage of the carrier gas gradually becomes larger along a flow of the carrier gas; an opening formation section (4) which has one or more openings (4a) via which a passage of the carrier gas and an external space communicate with each other; and a gas exit section (5) in which a passage of the carrier gas gradually becomes smaller along a flow of the carrier gas.
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公开(公告)号：EP3396021A1
公开(公告)日：2018-10-31
申请号：EP16878872.7
申请日：2016-12-22
发明人： HIRANO, Masaki
CPC分类号： B32B15/017 , C23C24/04 , C23C28/02 , C23C28/021
摘要： Provided are (i) a solder connection structure having improved solder wettability and including an aluminum base material and (ii) a film forming method for forming, on the aluminum base material, a metal film having high solder wettability. A solder connection structure (50) includes (i) an aluminum substrate (30), (ii) an Ni film (35) formed on the aluminum substrate by a cold spray method, and (iii) a mixed metal film (40) provided on the Ni film, the mixed metal film (40) being formed by the cold spray method with use of a mixed powder material, the mixed powder material being a mixture of Ni powder (41) and Sn powder (42). ( Fig. 1 )
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公开(公告)号：EP3623053A1
公开(公告)日：2020-03-18
申请号：EP18797647.7
申请日：2018-02-22
发明人： HIRANO, Masaki
摘要： The present invention provides a spray nozzle and the like each of which can control a film region easily. A spray nozzle (10) includes: a nozzle main body (1, 2, 3); a nozzle tip section (4) connected to a tip of the nozzle main body (1, 2, 3); and at least one path changing section (6) which is provided in a passage of the carrier gas in the nozzle tip section (4) and changes a path of the film material.
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公开(公告)号：EP4116460A1
公开(公告)日：2023-01-11
申请号：EP21763773.5
申请日：2021-03-05
发明人： HIRANO, Masaki
IPC分类号： C23C24/04
摘要： Provided is a spray nozzle that makes it possible to reduce a difference in film thickness in a film. A spray nozzle (1) for use in a cold spray device (100) includes: a nozzle main body (15) that has a first path (20) through which a film material and a carrier gas pass; and a nozzle tip section (16) that is provided at a tip section of the nozzle main body (15) and has a second path (21) which communicates with the first path (20), the second path (21) being broadened at a position apart from a cross-sectional center (P) of the second path (21). ( Fig. 1 )
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5.发明公开
公开(公告)号：EP4112775A1
公开(公告)日：2023-01-04
申请号：EP21759583.4
申请日：2021-02-26
发明人： HIRANO, Masaki
IPC分类号： C23C24/04
摘要： Even in a case where a spray nozzle of a solid phase particle deposition device is in motion, flying solid phase particles are efficiently collected. An attachment (1) includes: an engagement part (2) to be engaged with a spray nozzle (130) of a cold spray device (1); and an opening part (3) connected to the engagement part (2) and having at least one opening (3a, 3b) to be connected to a collection section (20) that is configured to collect solid phase particles (30b) which are sprayed through the spray nozzle (130) onto a base material (170) and are not involved in formation of a film on the base material (170). ( Fig. 1 )
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公开(公告)号：EP3299492A1
公开(公告)日：2018-03-28
申请号：EP16796389.1
申请日：2016-05-12
发明人： HIRANO, Masaki
CPC分类号： B23K35/3033 , B23K1/20 , B23K35/26 , C22C19/03 , C23C24/04
摘要： Provided are (i) a solder connection structure for enhancing solder wettability and (ii) a film forming method, carried out so as to enhance solder wettability, for forming a metal film on an aluminium base material. A solder connection structure to be connected with a member via a solder material, includes: an aluminium substrate; and a metal film provided on the aluminium substrate, the metal film being formed by a cold spray method in which a mixed powder material is used, the mixed powder material being a mixture of Ni powder and Sn powder.
摘要翻译： 本发明提供一种用于提高焊料浸润性的焊料连接结构体和（ii）为了提高焊料浸润性而在铝基材上形成金属膜的成膜方法。 要通过焊接材料与构件连接的焊料连接结构包括：铝基板; 以及设置在所述铝基板上的金属膜，所述金属膜通过使用混合粉末材料的冷喷涂方法形成，所述混合粉末材料是Ni粉末和Sn粉末的混合物。
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公开(公告)号：EP3928872A1
公开(公告)日：2021-12-29
申请号：EP21192174.7
申请日：2018-02-22
发明人： HIRANO, Masaki
摘要： The present invention provides a spray nozzle and the like each of which can control a film region easily. A spray nozzle (10) includes: a nozzle main body (1, 2, 3); a nozzle tip section (4) connected to a tip of the nozzle main body (1, 2, 3); and at least one path changing section (6) which is provided in a passage of the carrier gas in the nozzle tip section (4) and changes a path of the film material. A cross section of the at least one path changing section (6) which cross section is taken along a direction in which the carrier gas flows is in a shape that allows the path of the film material to be changed so that the film material is delivered onto the base material. The cross section of the at least one path changing section (6) which cross section is taken along a direction in which the carrier gas flows is in a shape of a triangle, and one of three sides of the triangle is parallel to a surface of the base material. Further, a film forming device and a film forming method are provided.
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公开(公告)号：EP3703187A1
公开(公告)日：2020-09-02
申请号：EP18870279.9
申请日：2018-05-11
发明人： HIRANO, Masaki
摘要： The present invention provides an electric wire joining structure (80), an electric wire joining method, and a terminal (1), each of which allows a reduction in burden on an operator. The present invention includes: one or more electric wires (10); a terminal (1) including one or more insertion holes (7) for the respective one or more electric wires (10), the one or more electric wires (10) being inserted into the respective insertion holes (7); and a joining part (20) formed by thermal spraying, the joining part (20) joining the one or more electric wires (10) to the terminal (1) on a side on which the one or more electric wires (10) have passed through the respective one or more insertion holes (7).
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