摘要:
A test and measurement instrument and a method of calibrating the test and measurement instrument including a reference signal generator (12); multiple input channels (14); and multiple input circuits (16). Each input channel is coupled to a corresponding input circuit; and one of the input circuits is coupled to the reference signal generator.
摘要:
A method and device for measuring a signal of a die to be placed within a package is disclosed. At least one die as a Device Under Test (DUT) is mounted on a substrate and a chip-type measurement instrument is mounted on the substrate, or embedded into the substrate, wherein the instrument analyzes and/or processes the signal of the DUT and may provide stimulus signal to the DUT. The substrate having the DUT and the measurement instrument is mounted on a circuit board that has plural electrodes to be connected to the signal paths of the DUT and the instrument. An electrode is coupled to a standard interface port to provide the signal of the chip-type instrument to an external instrument.
摘要:
A test and measurement instrument and a method of calibrating the test and measurement instrument including a reference signal generator (12); multiple input channels (14); and multiple input circuits (16). Each input channel is coupled to a corresponding input circuit; and one of the input circuits is coupled to the reference signal generator.