公开(公告)号：EP4390749A1

公开(公告)日：2024-06-26

申请号：EP23864158.3

申请日：2023-05-23

申请人： Tencent Technology (Shenzhen) Company Limited

发明人： MA, Shengming ,  HU, An ,  ZHANG, Tianyu ,  HUAI, Sainan ,  ZHANG, Shengyu ,  HUANG, Zhao ,  XU, Xiong ,  LI, Yanghepu

IPC分类号： G06F30/392

摘要： An air bridge deployment method and apparatus in a circuit layout, a device, a medium, and a product are provided, and in particular, relate to the field of chip technologies. The method includes: obtaining position information of skeleton lines of CPW lines based on position information of the CPW lines in the circuit layout, each skeleton line being a center line of a respective CPW line (320); obtaining an interweave pair from the skeleton lines of the CPW lines based on the position information of the skeleton lines of the CPW lines, the interweave pair including two interweaved skeleton lines (330); and deploying air bridges on the circuit layout along the skeleton lines, and the air bridges on the two skeleton lines in the interweave pair being arranged in a staggered manner (340). According to the foregoing solution, impacts between air bridges on different CPW lines are reduced, and a success rate of subsequent circuit fabrication is improved.