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公开(公告)号：EP1158257B1
公开(公告)日：2004-10-27
申请号：EP99935126.5
申请日：1999-08-10
发明人： MAEDA, Norio , SUMI, Koji , AIHARA, Hiroshi, Kanaoka Koujou, Sakai Seisakusho , OONO, Masao, Kanaoka Koujou, Sakai Seisakusho , IZUTANI, Naoaki, Kanaoka Koujou, Sakai Seisakusho
IPC分类号： F26B21/00 , H01L21/304
CPC分类号： H01L21/67051 , H01L21/67028 , H01L21/67034
摘要： A device for drying substrates which stores a plurality of substrates (1) and which comprises a processing container (3) to which cleaning fluid (2) after cleaning the substrates (1) is drained and an injection nozzle (5) for injecting drying fluid located at the terminating part of a feed pipe (4) through which liquid drying fluid is supplied, whereby an exhaust equipment is eliminated or simplified, and the drying fluid is fed smoothly.
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公开(公告)号：EP1158257A1
公开(公告)日：2001-11-28
申请号：EP99935126.5
申请日：1999-08-10
发明人： MAEDA, Norio , SUMI, Koji , AIHARA, Hiroshi, Kanaoka Koujou, Sakai Seisakusho , OONO, Masao, Kanaoka Koujou, Sakai Seisakusho , IZUTANI, Naoaki, Kanaoka Koujou, Sakai Seisakusho
IPC分类号： F26B21/00 , H01L21/304
CPC分类号： H01L21/67051 , H01L21/67028 , H01L21/67034
摘要： A device for drying substrates which stores a plurality of substrate (1) and which comprises a processing container (3) to which cleaning fluid (2) after cleaning the substrates (1) is drained and an injection nozzle (5) for injecting drying fluid located at the terminating part of a feed pipe (4) through which liquid drying fluid is supplied, whereby an exhaust equipment is eliminated or simplified, and the drying fluid is fed smoothly.
摘要翻译： 一种用于干燥存储多个基板（1）的基板的装置，其中包括一个处理容器（3），清洗基板（1）之后清洁流体（2）被排出，并且用于注入干燥流体的喷嘴 位于供给管（4）的终端部分，通过该进料管供应液体干燥流体，从而消除或简化排气设备，并且干燥流体被顺利地供给。
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公开(公告)号：EP1170564A1
公开(公告)日：2002-01-09
申请号：EP00900411.0
申请日：2000-01-17
发明人： MAEDA, Norio , SUMI, Koji , AIHARA, Hiroshi , OONO, Masao , MATSUMOTO, Takao , IZUTANI, Naoaki
IPC分类号： F26B21/04 , H01L21/304
CPC分类号： H01L21/67028 , Y10S134/902
摘要： A device for drying substrate comprising a processing vessel housing a specified number of substrates such as semiconductor wafers installed erectedly in parallel to one another, a first substrate supporting member supporting substrates within the processing vessel, the processing fluid supplying section supplying to the processing vessel, the processing fluid for performing processing such as cleaning processing on the substrates, a processing fluid exhausting section exhausting processing fluid from the processing vessel, and a drying fluid supplying section supplying, to the processing vessel, the liquid drops of drying fluid for performing drying processing on the substrates.
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公开(公告)号：EP1170564B1
公开(公告)日：2004-07-07
申请号：EP00900411.0
申请日：2000-01-17
发明人： MAEDA, Norio , SUMI, Koji , AIHARA, Hiroshi , OONO, Masao , MATSUMOTO, Takao , IZUTANI, Naoaki
IPC分类号： F26B21/04 , H01L21/304 , H01L21/306 , H01L21/00
CPC分类号： H01L21/67028 , Y10S134/902
摘要： A substrate drying device, comprising a treatment chamber (2) storing a specified number of substrates (1) such as semiconductor wafers installed erectedly in parallel with each other, a first substrate supporting part (3) supporting substrates (1) inside the treatment chamber (2), a treatment liquid feed part (4) feeding, to the treatment chamber (2), the treatment liquid for performing a treatment such as a cleaning treatment on the substrates (1), a delivery part (5) delivering treatment liquid from the treatment chamber (2), and a fluid feed part for drying (6) feeding, to the treatment chamber (2), the fluid drops of drying fluid for performing drying treatment on the substrates (1).
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