公开(公告)号：EP4461527A1

公开(公告)日：2024-11-13

申请号：EP22918899.0

申请日：2022-12-28

申请人： Toppan Holdings Inc.

发明人： FURUTA Kaoru ,  TOKINOYA Osamu ,  YAMADA Mikinori

IPC分类号： B32B9/00 ,  B32B27/36 ,  B65D65/40 ,  B32B7/027

摘要： A resin film is laminated thereon a gas barrier layer having gas barrier properties to constitute a laminate for a packaging body. The resin film contains polyethylene terephthalate. In a cross section of the resin film, the softening temperature of the resin film in the width direction and the softening temperature thereof in the flow direction measured by local thermal analysis are in the range of 200°C or more and 254°C or less.