摘要:
An epoxy composition includes an epoxy resin, a latent amine curing agent and a specific catalyst. Preferably, the epoxy resin includes two epoxide groups per molecule, and the latent amine curing agent is a dicyanopolyamide, most preferably, dicyandiamide. The specific catalyst is 2,4-toluene bis dimethyl urea. A prepreg employing the epoxy composition of the present invention can achieve a 95% cure in about one half of the time required by a prepreg that differs only in the catalyst employed. Furthermore, prepregs employing the epoxy composition of the present invention have glass transition temperatures higher than the curing temperatures when cured at a temperature range from about 80° C to about 150° C, enabling cured prepregs to be removed from molds without being cooled.