公开(公告)号：EP4396258A1

公开(公告)日：2024-07-10

申请号：EP22777062.5

申请日：2022-08-25

申请人： Ingevity South Carolina, LLC

发明人： LIU, Yongning ,  YU, Wumin ,  CHEN, Zhigang

IPC分类号： C08G59/18 ,  C08G59/16 ,  C08G59/50 ,  C08G59/68 ,  C08G18/42 ,  C08G59/06

CPC分类号： C08G59/1472 ,  C08G59/686 ,  C08G59/5013 ,  C08G59/066 ,  C08G59/186 ,  C08G18/7664 ,  C08G18/36 ,  C08G18/4277 ,  C08G18/6407 ,  C08G18/4045 ,  C08G18/6662

公开(公告)号：EP4380993A1

公开(公告)日：2024-06-12

申请号：EP21754688.6

申请日：2021-08-05

申请人： Evonik Operations GmbH

发明人： LI, Shuanghu ,  PENG, Qiubai

IPC分类号： C08G59/50 ,  C08G59/62 ,  C08G59/68 ,  C08J5/24

CPC分类号： C08G59/623 ,  C08G59/686 ,  C08G59/5013 ,  C08G59/5026 ,  C08G2650/5020130101 ,  Y02E10/72

公开(公告)号：EP4375310A2

公开(公告)日：2024-05-29

申请号：EP24169690.5

申请日：2018-09-10

申请人： Westlake Epoxy Inc.

发明人： Bansal, Amitabh ,  Corley, Steven Larry ,  Sepulveda-Camarena, Diana ,  Chung, Jennifer W. ,  Taylor, Leeanne ,  Hale, Alla

IPC分类号： C08G59/68

CPC分类号： C08G59/5073 ,  C08G59/686 ,  C08G59/36 ,  C08G59/4071 ,  C08G59/3245

摘要： Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.

公开(公告)号：EP4355745A1

公开(公告)日：2024-04-24

申请号：EP22743709.2

申请日：2022-06-15

申请人： Braskem, S.A.

发明人： CICARONI FERNANDES, Felipe ,  ESTRADA GOUVÊA, Iuri ,  DOMINGUES JÚNIOR, Nei Sebastião

IPC分类号： C07D407/14 ,  C08G59/26

CPC分类号： C07D407/14 ,  C08G59/26 ,  C08G59/027 ,  C08G59/04 ,  C08G59/5026 ,  C08G59/5033 ,  C08G59/4223 ,  C08G59/4207 ,  C08G59/686 ,  C08G59/226 ,  C09D163/00 ,  C08L63/00

公开(公告)号：EP3354674A1

公开(公告)日：2018-08-01

申请号：EP17192893.0

申请日：2017-09-25

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： KUSHIHARA, Naoyuki ,  SUMITA, Kazuaki

IPC分类号： C08G59/68 ,  C08K5/3415 ,  C08L63/00

CPC分类号： C08L63/00 ,  C08G59/245 ,  C08G59/4042 ,  C08G59/506 ,  C08G59/686 ,  C08K5/3415

摘要： Provided is a liquid epoxy resin composition that is superior in workability and adhesion to a base material, and exhibits an unimpaired resin reliability even under a high-temperature and high-humidity environment. The liquid epoxy resin composition contains (A) an epoxy resin; (B) an imidazole-based curing accelerator; and (C) a maleimide compound. The weight-average molecular weight (Mw) of the maleimide compound (C) is 500 to 2,000, and a maleimide group equivalent per 1 mol of the maleimide compound (C) is 250 to 1,000 g/eq.

公开(公告)号：EP3064521B1

公开(公告)日：2018-07-11

申请号：EP14878027.3

申请日：2014-11-28

申请人： SHIN-ETSU CHEMICAL CO., LTD

发明人： SUMITA, Kazuaki ,  UEHARA, Tatsuya ,  KUSHIHARA, Naoyuki

IPC分类号： C08G59/42 ,  C08K9/06 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  C08G59/32 ,  C08G59/68 ,  C08G59/24

CPC分类号： H01L21/561 ,  C08G59/245 ,  C08G59/3218 ,  C08G59/3227 ,  C08G59/3281 ,  C08G59/42 ,  C08G59/686 ,  C08K3/36 ,  C08K5/09 ,  C08K9/06 ,  C08K2201/003 ,  C08L63/00 ,  C09D7/62 ,  C09D7/63 ,  C09D163/00 ,  H01L21/78 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention relates to a liquid epoxy resin composition for semiconductor sealing, which contains: (A) a liquid epoxy resin that does not contain a siloxane bond in each molecule; (B) an acid anhydride-based curing agent; (C) a surface-treated spherical inorganic filler which is a spherical inorganic filler having an average particle diameter of 0.1-10 µm as determined by a laser diffraction method and serving as an inorganic filler, and wherein the surface of the spherical inorganic filler is surface-treated with 0.5-2.0 parts by weight of a (meth)acrylic functional silane coupling agent per 100 parts by weight of the spherical inorganic filler of the component (C); and (D) a curing accelerator. The present invention is able to provide a semiconductor device which has excellent heat resistance and moisture resistance.

公开(公告)号：EP3085736B1

公开(公告)日：2018-06-13

申请号：EP14871662.4

申请日：2014-12-17

申请人： Mitsubishi Materials Electronic Chemicals Co., Ltd.

发明人： KAGEYAMA, Kensuke ,  ISHIKURO, Shigeki

IPC分类号： C08L63/00 ,  C01G23/00 ,  C08K3/28 ,  C08K9/06 ,  C08L101/00 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L23/295 ,  C01B21/0821 ,  C01P2006/40 ,  C01P2006/62 ,  C08G59/621 ,  C08G59/686 ,  C08K3/28 ,  C08K3/36 ,  C08K9/02 ,  C08K9/06 ,  C08K2003/2241 ,  C08L63/00 ,  H01L2924/0002 ,  H01L2924/00

摘要： This black titanium oxynitride powder for use in a semiconductor sealing resin compound is coated on a surface thereof by a silica film having a thickness of 2.5-12 nm. The black titanium oxynitride powder has a volume resistivity of at least 1×10 5 ©·cm when in a state of pressurized powder body formed by compacting the powder at a pressure of 5 MPa. Moreover, the lightness index L* value of the black titanium oxynitride powder in the CIE 1976 L*a*b* color space (measurement light source C: color temperature 6774K) is 14 or less.

公开(公告)号：EP3320013A1

公开(公告)日：2018-05-16

申请号：EP16736981.8

申请日：2016-06-29

申请人： Dow Global Technologies LLC

发明人： JELTSCH, Krischan ,  MORLEY, Timothy A. ,  KOENIGER, Rainer ,  JELIC, Nebojsa ,  SIKMAN, Zeljko ,  GULYAS, Gyongyi ,  LOTTI, Luca

IPC分类号： C08G59/38 ,  C08G59/50 ,  C08G59/68 ,  C08G59/42

CPC分类号： C08G59/686 ,  C08G59/38 ,  C08G59/4215 ,  C08G59/5026 ,  C08J5/042 ,  C08J2363/02 ,  C08J2463/04

摘要： A two-component curable epoxy resin system having an epoxy component containing a unique combination of two or more epoxy resins with at least one of the epoxy resins being an epoxy novolac type resin. The composite made from such resin system exhibits high glass transition temperature.

公开(公告)号：EP3156451A4

公开(公告)日：2018-01-24

申请号：EP14894564

申请日：2014-06-10

申请人： SHENGYI TECHNOLOGY CO LTD

发明人： YOU JIANG

IPC分类号： C08L63/00 ,  B32B27/38 ,  B32B27/42 ,  C08G14/06 ,  C08G59/32 ,  C08G59/62 ,  C08G59/68 ,  C08J5/24 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/00 ,  C08L61/06 ,  C08L61/34 ,  C08L63/04 ,  H05K1/03

CPC分类号： C08L63/00 ,  B32B27/38 ,  B32B27/42 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/714 ,  B32B2307/726 ,  B32B2307/7265 ,  B32B2307/734 ,  B32B2457/08 ,  C08G14/06 ,  C08G59/3218 ,  C08G59/5073 ,  C08G59/621 ,  C08G59/686 ,  C08J5/24 ,  C08J2363/00 ,  C08J2379/02 ,  C08J2379/04 ,  C08J2461/06 ,  C08J2463/00 ,  C08J2479/02 ,  C08J2479/04 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K5/49 ,  C08L61/04 ,  C08L61/06 ,  C08L61/34 ,  C08L63/04 ,  C08L79/02 ,  C08L79/04 ,  C08L79/06 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/03 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/015

摘要： The present invention discloses a halogen-free resin composition, and a prepreg and a laminate used for printed circuit. The halogen-free resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin; alkyl phenol novolac curing agent; phosphorus-containing flame retardant. The alkyl phenol epoxy resin used in the present invention has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties while it has higher glass transition temperature, low water absorption and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With alkyl phenol novolac being used as curing agent, the advantages that the molecular structure thereof has many alkyls and thus the dielectric properties are excellent and the water absorption is low are fully played. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constant, low dielectric loss factor, low water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.

公开(公告)号：EP3237479A1

公开(公告)日：2017-11-01

申请号：EP15813839.6

申请日：2015-12-18

申请人： Henkel AG & Co. KGaA

发明人： HOLTGREWE, Christian ,  KÜSTER, Harald ,  BACHON, Thomas ,  SCHÖNFELD, Rainer

IPC分类号： C08G18/48 ,  C08G18/76 ,  C08G59/68 ,  C08G18/00 ,  C08G18/20

CPC分类号： C08G18/2027 ,  C08G18/003 ,  C08G18/4825 ,  C08G18/7664 ,  C08G18/7671 ,  C08G59/686

摘要： The present invention relates to a catalyst composition for curing resins containing epoxy groups, in particular epoxy/polyurethane hybrid resins, said composition containing an imidazolium salt of formula (I), as defined herein, in addition to a base. The invention also relates to a method for curing these resins in the presence of the catalyst composition, to the use of said catalyst composition for curing resins containing epoxy groups, to resin systems comprising a resin containing epoxy groups and the catalyst composition, and to a dosing system that comprises the resin and the catalyst composition.

摘要翻译： 本发明涉及用于固化含有环氧基团的树脂，特别是环氧/聚氨酯杂化树脂的催化剂组合物，所述组合物除了碱之外还含有如本文所定义的式（I）的咪唑鎓盐。 本发明还涉及在催化剂组合物存在下固化这些树脂的方法，所述催化剂组合物用于固化含有环氧基团的树脂的用途，包含含有含环氧基团的树脂和催化剂组合物的树脂体系，以及 包含树脂和催化剂组合物的定量给料系统。