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1.发明公开ANTISTATIC THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE MADE FROM SAME 有权抗生素热塑化剂HARZZUSAMMENSETZUNG UND DARAUS HERGESTELLTERFORMKÖRPER
公开(公告)号：EP1985661A1
公开(公告)日：2008-10-29
申请号：EP07708080.2
申请日：2007-02-06
CPC分类号： C08L25/12 , C08K5/34 , C08L33/12 , C08L51/04 , C08L55/02 , C08L67/025 , C08L77/12 , C08L2666/02 , C08L2666/04
摘要： This invention is an antistatic thermoplastic resin composition comprising 0.01 to 20 parts by weight of an organic ion conductive agent mixed with 100 parts by weight of a thermoplastic resin composition consisting of 97 to 55 parts by weight of a styrene-based resin and 3 to 45 parts by weight of a copolymer containing alkylene oxide units as a component, and a molded article composed thereof.
The antistatic thermoplastic resin composition of this invention is low in surface resistivity value, stable in sustained antistatic property and excellent in moldability, surface appearance and mechanical properties, and can be suitably used as molded articles such as electric and electronic parts, carrier parts for electric and electronic parts, carrier parts for display related parts, etc.摘要翻译： 本发明是一种抗静电热塑性树脂组合物，其包含0.01至20重量份的有机离子导电剂与100重量份由97至55重量份苯乙烯基树脂组成的热塑性树脂组合物和3至45重量份 包含烯化氧单元作为组分的共聚物的重量份，以及由其组成的模制品。 本发明的抗静电热塑性树脂组合物的表面电阻率低，持久的抗静电性能稳定，成型性，表面外观和机械性能优异，可以适用于电气电子部件，电子载体部件 电子零件，显示相关零件的载体零件等。
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公开(公告)号：EP4410898A1
公开(公告)日：2024-08-07
申请号：EP22875789.4
申请日：2022-09-12
IPC分类号： C08L81/02 , C08G75/0209 , C08K5/5435 , C08K5/544 , C08K5/5465
CPC分类号： C08K5/5435 , C08G75/0209 , C08K5/5465 , C08L81/02 , C08K5/544
摘要： A polyarylene sulfide resin composition including: 100 parts by weight of (A) a polyarylene sulfide; and 0.1 to 5 parts by weight of (B) an organic silane coupling agent having at least one functional group selected from the group consisting of an epoxy group, an amino group, and an isocyanate group, wherein, when the cumulative integral value from the molecular weight of 100 to the molecular weight of 10,000 in a molecular weight distribution curve of (A) the polyarylene sulfide is taken as 100, the cumulative integrated value at the molecular weight of 4,000 is 48 to 53, and wherein, when the melt flow rate of (A) the polyarylene sulfide is defined as MFR1, and when the melt flow rate obtained after mixing (A) the polyarylene sulfide with an epoxy silane coupling agent at a weight ratio of 100:1, and heating the resulting mixture at 315.5°C for 5 minutes is defined as MFR2, the rate of change represented by MFR2/MFR1 is not more than 0.085. Provided is a polyarylene sulfide resin composition having excellent mechanical strength and toughness, and having excellent moldability.
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3.发明公开
公开(公告)号：EP3708612A1
公开(公告)日：2020-09-16
申请号：EP18876169.6
申请日：2018-11-02
发明人： NOGUCHI, Gen , YAMANOUE, Hisashi , SAITO, Kei
摘要： The present invention provides a polyphenylene sulfide resin composition including: from 99.5 to 51 parts by weight of a polyphenylene sulfide resin (A); from 0.5 to 49 parts by weight of an aromatic vinyl compound block copolymer (B) containing at least one functional group selected from the group consisting of a carboxyl group, an acid anhydride group, a hydroxyl group, an amino group, an epoxy group and an isocyanate group; and from 0.1 to 2.0 parts by weight, with respect to 100 parts by weight of the total amount of the polyphenylene sulfide resin (A) and the aromatic vinyl compound block copolymer (B), of an alkoxysilane compound (C) containing at least one functional group selected from the group consisting of an epoxy group, an amino group and an isocyanate group; wherein the morphology (phase structure) of the polyphenylene sulfide resin composition has a sea-island structure in which the polyphenylene sulfide resin (A) forms a continuous phase (sea phase), and the aromatic vinyl compound block copolymer (B) forms a dispersed phase (island phase) dispersed in a number average dispersed particle size of 1,000 nm or less. The present invention provides a polyphenylene sulfide resin composition having an excellent impact resistance strength and water pressure resistance strength.
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4.发明公开
公开(公告)号：EP3604448A1
公开(公告)日：2020-02-05
申请号：EP18774833.0
申请日：2018-03-16
发明人： YAMANOUE, Hisashi , NOGUCHI, Gen , SAITO, Kei
摘要： A poly(phenylene sulfide) resin composition characterized by comprising (A) 100 parts by weight of an acid-treated polyphenylene sulfide resin, (B) 10 to 100 parts by weight of a glass fiber, and (C) 0.1 to 10 parts by weight of an amino group-containing alkoxysilane compound, wherein said polyphenylene sulfide resin composition has an exothermic peak temperature (Tmc) of 195°C to 225°C, said exothermic peak temperature being observed during a crystallization caused when said polyphenylene sulfide resin composition is melted by heating to 340°C and then cooled at a rate of 20°C/minute, using a differential scanning calorimeter. The poly (phenylene sulfide) resin composition has excellent water pressure cracking strength.
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公开(公告)号：EP4410897A1
公开(公告)日：2024-08-07
申请号：EP22875788.6
申请日：2022-09-12
IPC分类号： C08L81/02 , C08G75/0209 , C08K5/5435 , C08K5/544 , C08K7/14
CPC分类号： C08K7/14 , C08K5/5435 , C08G75/0209 , C08L81/02 , C08K5/544
摘要： A polyarylene sulfide resin composition including: 100 parts by weight of (A) a polyarylene sulfide; 10 to 100 parts by weight of (B) a glass fiber; and 1 to 20 parts by weight of (C) an olefin elastomer resin, wherein, when the cumulative integral value from the molecular weight of 100 to the molecular weight of 10,000 in a molecular weight distribution curve of (A) the polyarylene sulfide is taken as 100, the cumulative integrated value at the molecular weight of 4,000 is 48 to 53, and wherein, when the melt flow rate of (A) the polyarylene sulfide is defined as MFR1, and when the melt flow rate obtained after mixing (A) the polyarylene sulfide with an epoxy silane coupling agent at a weight ratio of 100:1, and heating the resulting mixture at 315.5°C for 5 minutes is defined as MFR2, the rate of change represented by MFR2/MFR1 is not more than 0.085. Provided is a polyarylene sulfide resin composition having excellent low gasification properties, having excellent mechanical strength, particularly hydraulic fracture strength, having good flowability, and thus having improved moldability.
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公开(公告)号：EP4317263A1
公开(公告)日：2024-02-07
申请号：EP22780563.7
申请日：2022-03-25
IPC分类号： C08J3/20 , C08K5/544 , C08L23/00 , C08L81/02 , C08G75/0209 , C08G75/0231 , C08G75/0259
摘要： A polyphenylene sulfide resin composition obtained by mixing 100 parts by weight of a polyphenylene sulfide resin (A) having a melt viscosity of more than 200 Pa·s at a temperature of 310°C, a ratio LID of an orifice length L to an orifice diameter D of 10 and a shear rate of 1,216/s, and 3 parts by weight to 25 parts by weight of an olefinic elastomer resin (B), wherein the melt viscosity at the temperature of 320°C, the ratio LID of the orifice length L to the orifice diameter D of 40 and the shear rate of 4,700/s is 120 Pa·s or more and 200 Pa·s or less, and a weight loss on heating is 0.8% by weight or less when heated in an air atmosphere at the temperature of 320°C for 2 hours. Provided is a polyphenylene sulfide resin composition having excellent impact resistance, low burr properties and low gas properties.
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7.发明授权
公开(公告)号：EP1985661B1
公开(公告)日：2012-08-01
申请号：EP07708080.2
申请日：2007-02-06
IPC分类号： C08L25/12 , C08K5/3435 , C08K5/3445 , C08K5/42 , C08K5/435 , C08L67/02 , C08L77/12 , C08L51/04 , C08L55/02
CPC分类号： C08L25/12 , C08K5/34 , C08L33/12 , C08L51/04 , C08L55/02 , C08L67/025 , C08L77/12 , C08L2666/02 , C08L2666/04
摘要： Disclosed is an antistatic thermoplastic resin composition obtained by blending 0.01-20 parts by weight of an organic ion conductive agent into 100 parts by weight of a thermoplastic resin composition which is composed of 97-55 parts by weight of a styrene resin and 3-45 parts by weight of a copolymer which contains an alkylene oxide unit as a constituent. Also disclosed is a molded article made of such an antistatic thermoplastic resin composition. The antistatic thermoplastic resin composition has a low surface specific resistance, and exhibits stable and long-lasting antistatic performance. In addition, the antistatic thermoplastic resin composition is excellent in moldability , surface appearance and mechanical properties, and suitably used for molding articles such as electrical/electronic components, components for carrying electrical/electronic components, and components for carrying display related components.
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