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    ASSEMBLING APPARATUS
    1.
    发明公开
    ASSEMBLING APPARATUS 审中-公开

    公开(公告)号：EP3433651A1

    公开(公告)日：2019-01-30

    申请号：EP17718606.1

    申请日：2017-03-21

    申请人： Tyco Electronics (Shanghai) Co., Ltd. ,  Tyco Electronics (Zhuhai) Ltd.

    发明人： DENG, Yingcong ,  HU, Lvhai ,  DAI, Zhiyong ,  LIU, Yun ,  ZHANG, Dandan ,  YU, Qiang ,  CHEN, Wei ,  ZHANG, Ning

    IPC分类号： G02B6/42 ,  H01R13/658 ,  H05K9/00 ,  H01R43/18

    摘要： An assembling apparatus adapted to assemble a case made of thin plate. The case comprises a bottom case and a top case, a latch is formed on each side wall of the bottom case, and a locking spring is formed on each side plate of the top case. When the side plates of the top case are located at a predetermined position with respect to the top wall of the top case, the lock springs are adapted to be fitted into the latches from inner sides of the latches, respectively. The assembling apparatus comprises: a base configured to position and support the bottom case; an operation mechanism adapted to hold and move the top case; and a guide device adapted to be disposed at the inner side of the latch and configured to guide the side plate to the predetermined position, so that the lock spring on the side plate of the top case is capable of being fitted into the latch. In the present invention, the guide device may automatically correct the position deviation of the side plates of the top case by guiding the side plates offset from a predetermined position to the predetermined position. As a result, the lock spring on the side plate of the top case is smoothly fitted into the latch, improving the assembly efficiency of the case made of thin plate.