公开(公告)号：EP2566908B1

公开(公告)日：2017-12-06

申请号：EP11721172.2

申请日：2011-05-05

申请人： Tyco Electronics Services GmbH

发明人： LI, Haiying ,  HARRISON, William Lee

IPC分类号： C08G59/22 ,  C08G59/32 ,  C08G59/38 ,  C08G59/50 ,  C08L63/00 ,  C09J163/00 ,  H01L23/29

CPC分类号： H01L23/293 ,  C08G59/226 ,  C08G59/32 ,  C08G59/38 ,  C08G59/50 ,  C08L63/00 ,  C08L2666/22 ,  C09J163/00 ,  H01L2924/0002 ,  H01L2924/00

摘要： A potting material for an electronic component, an electronic component, and a process for positioning ferrites in an electronic material are disclosed. The potting material is formed by curing a mixture. The mixture includes an epoxy component, an organic amine hardener, a viscosity-controlling agent, and a silica. The potting material has a coefficient of thermal expansion between an inorganic ferrite coefficient of thermal expansion and an organic substrate coefficient of thermal expansion of the electronic component. The potting material includes a rigidity permitting via drilling by one or more of mechanical drilling and laser burning.

公开(公告)号：EP2566908A2

公开(公告)日：2013-03-13

申请号：EP11721172.2

申请日：2011-05-05

申请人： Tyco Electronics Services GmbH

发明人： LI, Haiying ,  HARRISON, William Lee

IPC分类号： C08G59/22 ,  C08G59/32 ,  C08G59/38 ,  C08G59/50 ,  C08L63/00 ,  C09J163/00 ,  H01L23/29

CPC分类号： H01L23/293 ,  C08G59/226 ,  C08G59/32 ,  C08G59/38 ,  C08G59/50 ,  C08L63/00 ,  C08L2666/22 ,  C09J163/00 ,  H01L2924/0002 ,  H01L2924/00

摘要： A potting material for an electronic component, an electronic component, and a process for positioning ferrites in an electronic material are disclosed. The potting material is formed by curing a mixture. The mixture includes an epoxy component, an organic amine hardener, a viscosity-controlling agent, and a silica. The potting material has a coefficient of thermal expansion between an inorganic ferrite coefficient of thermal expansion and an organic substrate coefficient of thermal expansion of the electronic component. The potting material includes a rigidity permitting via drilling by one or more of mechanical drilling and laser burning.

摘要翻译： 公开了一种用于电子部件的灌封材料，电子部件以及将铁氧体定位在电子材料中的工艺。 灌封材料通过固化混合物形成。 该混合物包括环氧组分，有机胺硬化剂，粘度控制剂和二氧化硅。 灌封材料具有无机铁氧体热膨胀系数与电子部件的有机基板热膨胀系数之间的热膨胀系数。 灌封材料包括通过一次或多次机械钻孔和激光燃烧钻孔的刚性。