公开(公告)号：EP4370577A1

公开(公告)日：2024-05-22

申请号：EP22842990.8

申请日：2022-05-19

申请人： Henkel AG & Co. KGaA

发明人： KONG, Stanley Shengqian

IPC分类号： C08G59/42 ,  C08L63/00 ,  B32B7/12 ,  C09J163/00

CPC分类号： C09J163/00 ,  C08G65/18 ,  C08G59/186 ,  C08G59/32 ,  C08G59/4223 ,  C08G59/423

公开(公告)号：EP3327091A1

公开(公告)日：2018-05-30

申请号：EP16306547.7

申请日：2016-11-23

申请人： Essilor International

发明人： ZHENG, Haipeng

IPC分类号： C09D5/32 ,  C09D7/00 ,  C09D163/00 ,  G02C7/10 ,  G02C7/02 ,  B29D11/00

CPC分类号： C09D5/32 ,  B29D11/00038 ,  B29D11/00865 ,  C08G59/32 ,  C08G59/3218 ,  C08G59/36 ,  C08K5/0041 ,  C09D7/63 ,  C09D163/00 ,  G02C7/022 ,  G02C7/10

摘要： The present invention relates to an optical filtering coating composition, comprising at least one dye that at least partially inhibits transmission of light within the 400 - 500 nm wavelength range and has a conjugated chromophore, one or more epoxy compounds comprising at least one cycloaliphatic or aryl group, the ratio of the number of carbon atoms / the number of oxygen atoms in said epoxy compound being higher than or equal to 3, and the dry extract weight of such epoxy compounds present in the composition representing more than 33 % of the dry extract weight of the composition. The coating composition can be applied on the main surface of the substrate of an optical article.

公开(公告)号：EP3315530A1

公开(公告)日：2018-05-02

申请号：EP16814388.1

申请日：2016-06-22

申请人： Toray Industries, Inc.

发明人： MORI, Ayumi ,  HIRANO, Noriyuki ,  MIYOSHI, Masayuki

IPC分类号： C08G59/28 ,  C08G59/32 ,  C08G59/50 ,  C08J5/04

CPC分类号： C08J5/043 ,  B01J3/04 ,  C08G59/245 ,  C08G59/28 ,  C08G59/32 ,  C08G59/3218 ,  C08G59/3227 ,  C08G59/4238 ,  C08G59/50 ,  C08G59/5026 ,  C08G59/5033 ,  C08G59/504 ,  C08J5/04 ,  C08J2363/00

摘要： One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. The other purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both comprising the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition comprises the following constituent element [A] and the following constituent element [B], and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95ºC or higher. [A] An epoxy resin including an aromatic ring and having a functionality of 2 or higher [B] An amine-based hardener or an acid anhydride-based hardener.

摘要翻译： 本发明的一个目的是提供一种环氧树脂组合物，其用于获得将耐热性与拉伸强度高度结合的纤维增强复合材料。 另一目的是提供：使用该环氧树脂组合物得到的纤维增强复合材料; 以及均包含纤维增强复合材料的模制品和压力容器。 为了实现上述目的，本发明具有以下配置。 即，环氧树脂组合物含有下述构成元素[A]和下述构成元素[B]，其特征在于，使环氧树脂组合物固化而得到的固化物的橡胶状态模量为10MPa以下时 评价动态粘弹性，并且固化物具有95℃或更高的玻璃化转变温度。 [A]含有芳香环且官能度为2以上的环氧树脂[B]胺类固化剂或酸酐类固化剂。

公开(公告)号：EP3288998A1

公开(公告)日：2018-03-07

申请号：EP16787206.8

申请日：2016-04-29

申请人： 3M Innovative Properties Company

发明人： ZOOK, Jonathan D. ,  DEMOSS, Susan E. ,  YE, Sheng ,  DAVIS, Andrew R. ,  GONG, Tao

IPC分类号： C08G59/66 ,  C08G59/40 ,  C08G59/68 ,  C08G75/00 ,  B05D1/36

CPC分类号： C08G59/4021 ,  C08G59/22 ,  C08G59/32 ,  C08G59/56 ,  C08G59/66 ,  C08G59/686 ,  C08G75/02 ,  C08G75/04 ,  C08L63/00 ,  C08L81/02 ,  C08L81/04

摘要： A method of making a polymer network. The method includes providing a composition including a polythiol having more than one thiol group and a polyepoxide having more than one epoxide group, applying a solution including a photolatent base catalyst to a surface of the composition, and subsequently exposing the composition to light. Upon exposure to light, the photolatent base catalyst photochemically generates a first amine and at least partially cures at least the surface of the composition to form the polymer network.

公开(公告)号：EP3280755A2

公开(公告)日：2018-02-14

申请号：EP16720229.0

申请日：2016-04-10

申请人： Ohio Soybean Council ,  Battelle Memorial Institute ,  Lalgudi, Ramanathan S. ,  Cain, Robert, J

发明人： LALGUDI, Ramanathan, S. ,  CAIN, Robert, J.

IPC分类号： C08G59/16 ,  C08G59/32

CPC分类号： C09D179/02 ,  B05D7/14 ,  B05D7/227 ,  B65D25/14 ,  C08G59/1455 ,  C08G59/32 ,  C09D177/00 ,  C11C3/00 ,  C11C3/006

摘要： Provided are polytriglyceride-AAG compositions, and corresponding coatings and coated articles. Also provided are methods for preparing the polytriglyceride-AAG compositions, and corresponding reagents including β-ketoimide compositions and triglyceride-AAG (acetoacetyl group) compositions. Coatings using the polytriglyceride-AAG compositions may be useful for, e.g., replacing bisphenol-A cross-linked coatings used in food and beverage containers, coating metal articles, and the like.

公开(公告)号：EP3165549A4

公开(公告)日：2017-12-20

申请号：EP15815767

申请日：2015-07-01

申请人： DAINIPPON INK & CHEMICALS

发明人： YOSHIMOTO YASUYO ,  KINOSHITA HIROSHI

IPC分类号： C08G59/32 ,  C08K3/00 ,  C08K7/02 ,  C08L63/00 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00

CPC分类号： C08G59/3218 ,  C08G59/32 ,  C08G59/5073 ,  C08K3/00 ,  C08K3/22 ,  C08K3/36 ,  C08K7/02 ,  C08K9/08 ,  C08K2003/2227 ,  C08K2201/001 ,  C08L63/00 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  H01L23/295 ,  H01L23/3737 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2924/01006 ,  H01L2924/04541 ,  H01L2924/0463 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/0532 ,  H01L2924/0542 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/186 ,  H05K1/0203 ,  H05K1/0373 ,  H05K2201/0104

摘要： An epoxy resin composition for electronic material, containing a polyfunctional biphenyl type epoxy resin that is a triglycidyloxybiphenyl or a tetraglycidyloxybiphenyl and at least one of a curing agent and a curing accelerator is provided. Furthermore, the epoxy resin composition for electronic material, further containing a filler, in particular, a thermal conductive filler, is provided. Furthermore, a cured product obtained by curing the epoxy resin composition for electronic material, and an electronic component containing the cured product are provided.

公开(公告)号：EP3165549A1

公开(公告)日：2017-05-10

申请号：EP15815767.7

申请日：2015-07-01

申请人： DIC Corporation

发明人： YOSHIMOTO Yasuyo ,  KINOSHITA Hiroshi

IPC分类号： C08G59/32 ,  C08K3/00 ,  C08K7/02 ,  C08L63/00 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00

CPC分类号： C08G59/3218 ,  C08G59/32 ,  C08G59/5073 ,  C08K3/00 ,  C08K3/22 ,  C08K3/36 ,  C08K7/02 ,  C08K9/08 ,  C08K2003/2227 ,  C08K2201/001 ,  C08L63/00 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  H01L23/295 ,  H01L23/3737 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2924/01006 ,  H01L2924/04541 ,  H01L2924/0463 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/0532 ,  H01L2924/0542 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/186 ,  H05K1/0203 ,  H05K1/0373 ,  H05K2201/0104

摘要： An epoxy resin composition for electronic material, containing a polyfunctional biphenyl type epoxy resin that is a triglycidyloxybiphenyl or a tetraglycidyloxybiphenyl and at least one of a curing agent and a curing accelerator is provided. Furthermore, the epoxy resin composition for electronic material, further containing a filler, in particular, a thermal conductive filler, is provided. Furthermore, a cured product obtained by curing the epoxy resin composition for electronic material, and an electronic component containing the cured product are provided.

摘要翻译： 提供一种电子材料用环氧树脂组合物，其含有作为三缩水甘油氧基联苯或四缩水甘油氧基联苯的多官能联苯型环氧树脂和固化剂和固化促进剂中的至少一种。 此外，提供了还含有填料，特别是导热填料的电子材料用环氧树脂组合物。 进而提供使电子材料用环氧树脂组合物固化而得到的固化物和含有该固化物的电子部件。

公开(公告)号：EP2829575B1

公开(公告)日：2017-04-05

申请号：EP12872123.0

申请日：2012-11-19

申请人： The Yokohama Rubber Co., Ltd.

发明人： TOMOI, Shusaku

IPC分类号： C08L77/00 ,  B29B7/46 ,  B29B7/88 ,  C08G59/32 ,  C08K5/00 ,  C08L23/08 ,  C08L23/26 ,  C08L29/04

CPC分类号： C08L33/08 ,  B29B7/482 ,  B29B7/88 ,  B29B9/065 ,  B29B9/16 ,  B29C47/0004 ,  B29C47/402 ,  B29C47/6056 ,  B29C47/6087 ,  B29K2021/003 ,  B29K2063/00 ,  B29K2077/00 ,  B29K2105/24 ,  C08G59/32 ,  C08G59/3209 ,  C08G69/48 ,  C08K5/0025 ,  C08L23/08 ,  C08L23/0861 ,  C08L23/26 ,  C08L51/06 ,  C08L77/02 ,  C08L77/06 ,  C08L2312/00 ,  C08L63/00 ,  C08L33/068 ,  C08L71/02

摘要： A method for producing a thermoplastic elastomer composition including a thermoplastic resin composition as a continuous phase and also including a modified elastomer dispersed into the continuous phase as a dispersed phase, wherein the method comprises, in the stated order: (1) a step for reacting a polyamide resin and an epoxy group-containing polymer together to generate an end-capped polyamide resin; (2) a step for adding EVOH and a modified elastomer to the product obtained in step (1); (3) a step for dispersing the EVOH into the product obtained in step (1); (4) a step for adding a cross-linking agent for cross-linking the modified elastomer to the dispersion obtained in step (3); and (5) a step for cross-linking the modified elastomer using the cross-linking agent; and wherein the thermoplastic resin composition comprises EVOH and an end-capped polyamide resin.

公开(公告)号：EP2924504B1

公开(公告)日：2017-03-22

申请号：EP13856225.1

申请日：2013-11-21

申请人： Nippon Kayaku Kabushiki Kaisha

发明人： IMAIZUMI, Naoko ,  INAGAKI, Shinya ,  HONDA, Nao

IPC分类号： G03F7/038 ,  G03F7/004 ,  G03F7/075

CPC分类号： G03F7/0755 ,  C08G59/063 ,  C08G59/24 ,  C08G59/245 ,  C08G59/32 ,  C08G59/3218 ,  C08G59/38 ,  C08G59/62 ,  C08G59/621 ,  C08K5/109 ,  C08K5/13 ,  C08K5/5419 ,  C08L33/068 ,  C08L63/00 ,  G03F7/038 ,  G03F7/0751

摘要： The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyhydric phenol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2). The reactive epoxy monomer (E) is a bisphenol epoxy resin.

公开(公告)号：EP2958904A4

公开(公告)日：2016-11-16

申请号：EP14753499

申请日：2014-02-17

申请人： ARKEMA INC

发明人： KAZEMIZADEH MOHAMMAD R ,  MAIXNER DAVID E

IPC分类号： C07D303/42 ,  C07D303/16 ,  C08G65/02

CPC分类号： C07D303/42 ,  C07D301/19 ,  C07D303/16 ,  C08G59/027 ,  C08G59/1444 ,  C08G59/1455 ,  C08G59/32 ,  C08K5/1515