公开(公告)号：EP0289168A1

公开(公告)日：1988-11-02

申请号：EP88303324.3

申请日：1988-04-13

申请人： UNITED KINGDOM ATOMIC ENERGY AUTHORITY

发明人： Turner, Andrew Derek ,  Pottinger, John Stewardson ,  Junkison, Anthony Richard ,  Dawson, Ronald Keith

IPC分类号： C25F3/24 ,  C25F7/00 ,  C25D11/00

CPC分类号： C25F7/00 ,  C25F3/24

摘要： A device for electrolytically treating, e.g. polishing, a metal surface (11) comprises a housing (1) for making sealing contact with the surface (11) thereby to enclose an area for electropolishing, and an electrolyte chamber (5) defined within the housing (1) bounded in part by said area when the housing (1) is connected to the surface (11). A cathode (4) for contacting the electrolyte during use is also mounted within the housing (1). Said sealing contact may be made by means of a deformable seal. In operation, electrolyte is provided in the chamber (5) in contact with the surface (11) and the cathode (4), and an electric current is passed through the electrolytic cell constituted by the surface (as anode) (11), the electrolyte and the cathode (4) in order to treat the surface (11) by anodic oxidation. Preferably, the electrolyte passes through the chamber (5).

摘要翻译： 一种电解处理装置。 金属表面（11）包括用于与表面（11）密封接触的壳体（1），从而包围用于电解抛光的区域，以及限定在壳体（1）内部的部分由 所述区域当所述壳体（1）连接到所述表面（11）时。 用于在使用期间接触电解质的阴极（4）也安装在壳体（1）内。 所述密封接触可以通过可变形密封件制成。 在操作中，在室（5）中提供与表面（11）和阴极（4）接触的电解质，并且电流通过由表面（阳极）（11）构成的电解槽， 电解质和阴极（4），以便通过阳极氧化处理表面（11）。 优选地，电解液通过室（5）。