摘要:
Described are devices including stimulation assemblies connectable to a plurality of electrodes. The plurality of electrodes can be configured to connect to a spinal cord at a location below a lesion of the spinal cord. The stimulation assembly can be configured to deliver stimulation to selected ones of the plurality of electrodes when the stimulation assembly is connected to the plurality of electrodes when located below the lesion of the spinal cord. Methods of using the devices are also described.