公开(公告)号：EP2647035A4

公开(公告)日：2015-04-08

申请号：EP11845971

申请日：2011-11-29

申请人： UNIV NORTHEASTERN

发明人： SIRMAN ASLI ,  BUSNAINA AHMED ,  YILMAZ CIHAN ,  HUANG JUN ,  SOMU SIVASUBRAMANIAN

IPC分类号： H01L21/20 ,  B82Y40/00 ,  C25D13/00 ,  H01L21/02

CPC分类号： C25D13/22 ,  B82Y30/00 ,  B82Y40/00 ,  C09D5/4407 ,  C09D5/4488 ,  C09D125/06 ,  C25D13/04 ,  C25D13/12 ,  C25D13/20 ,  H01L21/0243 ,  H01L21/0259 ,  H01L21/02628 ,  H01L29/0665 ,  H05K1/0213 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/1258 ,  Y10S977/882 ,  Y10S977/892

摘要： A method for high rate assembly of nanoelements into two-dimensional void patterns on a non-conductive substrate surface utilizes an applied electric field to stabilize against forces resulting from pulling the substrate through the surface of a nanoelement suspension. The electric field contours emanating from a conductive layer in the substrate, covered by an insulating layer, are modified by a patterned photoresist layer, resulting in an increased driving force for nanoelements to migrate from a liquid suspension to voids on a patterned substrate having a non-conductive surface. The method can be used for the production of microscale and nanoscale circuits, sensors, and other electronic devices.