公开(公告)号：EP3647469A1

公开(公告)日：2020-05-06

申请号：EP19206054.9

申请日：2019-10-29

申请人： Unison Industries LLC

发明人： JONNALAGADDA, Dattu GV ,  GOURISHANKAR, Karthick Vilapakkam ,  SEBASTIAN, Merin ,  KUMAR, Sandeep ,  TAJIRI, Gordon

IPC分类号： C25D1/00 ,  C25D21/18

摘要： An electroforming system (10) and method (100) for electroforming a component includes an electroforming reservoir (30) with a housing (50) with at least one inlet (40) and at least one outlet (42), and at least one anode chamber (54, 56) within the housing (50) and fluidly coupled to the at least one inlet (40). An anode (34) can be located within the at least one anode chamber (54, 56).