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公开(公告)号:EP1896165A1
公开(公告)日:2008-03-12
申请号:EP06741202.3
申请日:2006-06-07
申请人: Wriota Pty Ltd
IPC分类号: B01J3/06 , H01L21/322
CPC分类号: G11B7/263 , B81C1/00111 , B81C1/0046 , G11B7/00454 , G11B7/24079 , H01L21/0337 , H01L21/3086 , H01L31/18
摘要: A patterning process, including applying pressure to and removing pressure from one or more regions of a substance to transform a phase of one or more regions of the substance, the transformed one or more regions having respective predetermined shapes representing a predetermined pattern. The patterning process can be used to form nanoscale patterns in substances without requiring the use of photoresist or conventional optical or electron-beam lithography, thus avoiding the limitations of those techniques. For example, a semiconducting wafer with an amorphous or crystalline silicon surface layer can be patterned using a die or nano-indenter and subsequently used as elements in electronic, optical or mechanical devices.