A PATTERNING PROCESS
    1.
    发明公开
    A PATTERNING PROCESS 审中-公开
    结构化过程

    公开(公告)号:EP1896165A1

    公开(公告)日:2008-03-12

    申请号:EP06741202.3

    申请日:2006-06-07

    申请人: Wriota Pty Ltd

    IPC分类号: B01J3/06 H01L21/322

    摘要: A patterning process, including applying pressure to and removing pressure from one or more regions of a substance to transform a phase of one or more regions of the substance, the transformed one or more regions having respective predetermined shapes representing a predetermined pattern. The patterning process can be used to form nanoscale patterns in substances without requiring the use of photoresist or conventional optical or electron-beam lithography, thus avoiding the limitations of those techniques. For example, a semiconducting wafer with an amorphous or crystalline silicon surface layer can be patterned using a die or nano-indenter and subsequently used as elements in electronic, optical or mechanical devices.