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    Printer device, temperature adjustment method of printer device, and temperature adjustment system of printer device
    2.
    发明公开
    Printer device, temperature adjustment method of printer device, and temperature adjustment system of printer device 有权
    Druckvorrichtung，Temperatureinstellungsverfahren der Druckvorrichtung und Temperatureinstellungssystem der Druckvorrichtung

    公开(公告)号：EP2620283A1

    公开(公告)日：2013-07-31

    申请号：EP12007740.9

    申请日：2012-11-15

    申请人： Yamaha Hatsudoki Kabushiki Kaisha

    发明人： Usui, Yusuke

    IPC分类号： B41F15/08 ,  B41F15/12 ,  B41F15/26 ,  B41F15/36 ,  B41F15/42 ,  H05K3/12 ,  H05K3/34

    CPC分类号： B41J2/465 ,  B41F15/0881 ,  B41F15/12 ,  B41F15/26 ,  B41F15/36 ,  B41F15/423 ,  B41P2215/50 ,  H05K3/1216 ,  H05K3/1233 ,  H05K3/34 ,  H05K3/3484 ,  H05K2203/081 ,  H05K2203/1121

    摘要： The inside of a housing of a printer device is cooled by the air from a ventilation port and, consequently, the temperature of solder SP on a mask surface supported by a mask holding frame inside the housing can be kept low. Moreover, provided is a mask cover for blocking the air flow from the ventilation port toward the mask, and the drying of the solder SP caused by the wind from the ventilation port is thereby inhibited as a result of the wind from the ventilation port not coming into contact with the solder SP on the mask surface. In this way, the solder SP is cooled while inhibiting the drying of the solder SP and, consequently, it is possible to appropriately inhibit the change in viscosity of the solder SP, and favorable printing can be realized.

    摘要翻译： 打印机装置的壳体的内部由空气从通气口冷却，因此能够将由壳体内的掩模保持框支撑的掩模面上的焊料SP的温度保持为低。 此外，设置有用于阻挡从通气口朝向面罩的空气流的掩模罩，并且由于来自通风口的风而导致的来自通风口的风引起的焊料SP的干燥因此被抑制 与掩模表面上的焊料SP接触。 以这种方式，焊料SP被冷却，同时阻止焊料SP的干燥，因此，可以适当地抑制焊料SP的粘度变化，并且可以实现良好的印刷。