METHODS AND APPARATUS TO CONTROL TIG WELDING

    公开(公告)号:EP4442399A1

    公开(公告)日:2024-10-09

    申请号:EP24159986.9

    申请日:2024-02-27

    发明人: ALBRECHT, Bruce P

    IPC分类号: B23K9/10 B23K9/12 B23K9/167

    摘要: Example welding system comprise: a welding torch comprising a non-consumable electrode configured to establish an arc between the non-consumable electrode and a workpiece; a wire feeder coupled to the welding torch and configured to direct a welding wire toward the workpiece at a location of the arc; and control circuitry configured to control at least one of a current to the arc, a wire feed speed of the welding wire, or preheat energy applied to the welding wire, to deliver the welding wire to the workpiece such that the welding wire applies a physical force to the workpiece prior to melting to push the welding torch along the workpiece.

    SYSTEMS AND METHODS FOR UTILIZING WEARABLE WIRE FEEDERS

    公开(公告)号:EP4434665A3

    公开(公告)日:2024-10-09

    申请号:EP24165685.9

    申请日:2024-03-22

    IPC分类号: B23K9/133 B23K9/173 B23K9/32

    CPC分类号: B23K9/173 B23K9/1336 B23K9/32

    摘要: Systems and methods are provided for utilizing wearable wire feeders. An example welding-type system may include a wire feeder device (12)configured for operation in conjunction with a welding-type power supply unit and a welding-type torch (30), with the wire feeder device being a physically separate component from both of the welding-type power supply unit and the welding-type torch, and with the wire feeder device including, at least, a wire source configured to provide electrode wire, and a wire feeding mechanism configured to feed the electrode wire from the wire source. The wire feeder device (12) may be powered by the welding-type power supply unit, and the wire feeder device may be configured to feed the electrode wire to the welding-type torch.

    FORMULATIONS FOR APPLYING A HYDROPHILIC FILM TO A SUBSTRATE

    公开(公告)号:EP4438572A1

    公开(公告)日:2024-10-02

    申请号:EP24159290.6

    申请日:2024-02-23

    发明人: YANG, Guozhen

    摘要: A hydrophilic film forming composition is provided that includes a hydrophilic polymer based microemulsion. A surface tension reducing substance is also present. Water is provided as a solvent in which the microemulsion and the surface tension reducing substance are dissolved.
    A hydrophilic film forming composition is also provided that includes a hydrophilic polymer based microemulsion present in an amount of 5 to 45 total weight percent of the composition, and a surface tension reducing substance present in an amount of 5 to 15 total weight percent of the composition. An optional additive of at least one of a wetting agent, a dye, a bitterant, a defoamer, a light stabilizer, and a corrosion inhibitor may be present. The remainder of the composition is water. A process for applying a hydrophilic film to a substrate is also provided.