FORMULATIONS FOR APPLYING A HYDROPHILIC FILM TO A SUBSTRATE

    公开(公告)号:EP4438572A1

    公开(公告)日:2024-10-02

    申请号:EP24159290.6

    申请日:2024-02-23

    发明人: YANG, Guozhen

    摘要: A hydrophilic film forming composition is provided that includes a hydrophilic polymer based microemulsion. A surface tension reducing substance is also present. Water is provided as a solvent in which the microemulsion and the surface tension reducing substance are dissolved.
    A hydrophilic film forming composition is also provided that includes a hydrophilic polymer based microemulsion present in an amount of 5 to 45 total weight percent of the composition, and a surface tension reducing substance present in an amount of 5 to 15 total weight percent of the composition. An optional additive of at least one of a wetting agent, a dye, a bitterant, a defoamer, a light stabilizer, and a corrosion inhibitor may be present. The remainder of the composition is water. A process for applying a hydrophilic film to a substrate is also provided.