Abstract:
Provided is a die apparatus capable of removing powder adhering to cut surfaces so as to securely form a cavity in a desired shape. Each divided die 4i reciprocatingly driven by each slider 6i (i=a, b, c) comes into contact with one another so as to form the cavity 3. Punches 7a and 7b are inserted into the cavity 3 from above and below of the cavity 3. Each divided die 4i is provided with cut surfaces 11j (j=a, b) that come into contact with the other divided dies. A gas passage 16j connected to a gas injection port 12j that injects gas from the cut surface 11j is formed in each divided die 4i.
Abstract:
This invention is concerning a honeycomb core configured to include carbon fiber having four or more different fiber directions, wherein, when a ribbon direction is set as an X axis direction, a cell width direction is set as a Y axis direction, and a direction that is orthogonal to the ribbon direction and the cell width direction is set as a Z axis direction, and a condition in which angles formed by the X axis direction and the respective fiber directions of the carbon fiber are set at -45°, 0°, 45°, and 90° is set as a reference condition, the respective fiber directions are rotated from the reference condition by a fixed rotation angle so that none of the fiber directions are parallel to the X axis direction.
Abstract:
A compression-forming apparatus is disclosed comprising a plurality of forming units arranged on a rotating carousel, wherein each forming unit has a first half unit that carries the object to be compression-formed and is connected to an auxiliary member by a motion multiplying rocker, so that a movement of the auxiliary member by a certain amount is matched by a movement of greater amount of the first forming half unit; in use, the auxiliary member is moved by a cam follower coupled with a first cam profile to have an initial very fast closing step of the forming unit without compression force, after which a compression force is generated that is discharged on a second cam profile by another cam follower associated with the first forming half unit.
Abstract:
A method of plastic moulding to form a moulded or extruded article, the method employing a moulding apparatus comprising a barrel containing a screw extending between a feed zone supplied by a feed hopper for plastics material, a compression zone and a metering zone for delivery of molten plastics material to a mould or extrusion die, the method comprising introducing into the feed zone a first plastics material (20) and a single body of a second plastics material (22), the first plastics material (20) having a different physical property to the second plastics material and the second plastics material (22) being introduced into the feed zone in a size and a frequency of delivery relative to the flow of the material through the barrel such that the second plastics material (22) is substantially melted and blended with the first plastics material to form a third plastics material with a different physical property to the first or second plastics material across the whole cross sectional area of the metering zone, the molten plastics material delivered to the mould or extrusion die in a predetermined sequence with each plastics material having different physical properties.
Abstract:
A heating-type vacuum press device which has a small vacuum isolation chamber in which pressing is performed under vacuum without damage to seal packing, while heating. A lower fixed frame and an upper movement frame constitute a wall portion of the isolation chamber. A gas-tight sliding mechanism ensures gas-tightness between the lower fixed frame and the upper movement frame. Thereby, the isolation chamber is formed in a space defined by the lower fixed frame, the upper movement frame, a base and a fitting plate. The lower fixed frame surrounds a receiving table equipped with a heater for a workpiece, and is arranged on the base such that the lower fixed frame is spaced from the receiving table. The upper movement frame is hanged from the fitting plate such that the upper movement frame is spaced from a pressing plate equipped with a heater, and surrounds the pressing plate. The isolation chamber is sucked to vacuum, and a workpiece on the receiving plate is pressed under heating and vacuum at a high temperature with a low thrusting force by descending the pressing plate. The present apparatus is suitable for bonding multi-functional laminated films having high heat-resistant temperature.
Abstract:
Die Erfindung betrifft einen Laminator (1) zum Herstellen von Schichtkörpern, insbesondere von photovoltaischen Solarzellen-Modulen oder Verbundglasscheiben, bestehend aus mindestens einer Laminierkammer (10) mit mehreren darin etagenartig angeordneten, beheizbaren Laminierplatten (2), wobei auf jeder Laminierplatte (2) jeweils eine oder mehrere Laminatschichten (4') mit einem plattenförmigen Bauteil (4) verschweißbar sind und wobei der Laminator (1) Mittel zum Ausüben einer Andrückkraft auf die Bauteile (4) und die Laminatschichten (4') während des Laminiervorgangs aufweist. Der Laminator ist dadurch gekennzeichnet, daß pro Laminierplatte (2) je eine Andrückeinrichtung (3) vorgesehen ist, die jeweils durch eine randseitig dicht eingespannte Membran (30) gebildet ist, die an ihrer von einem benachbarten Bauteil (4) und den zugehörigen Laminatschichten (4') abgewandten Seite eine evakuierbare und belüftbare oder mit einem Druckmedium beschickbare oder von einem komprimierbaren und selbstrückstellbaren Material gefüllte Membrankammer (31) begrenzt.
Abstract:
A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low pressure environment, thus assuring the same kind of environment in the sealed chamber. The chamber may enclose at least one device such as a thermoelectric sensor, bolometer, emitter or other kind of device. The wafer-pair typically will have numerous chambers, with devices, respectively, and may be divided into a multiplicity of chips.