摘要:
A process for preparing an aliphatic or cycloaliphatic epoxy resin composition including the steps of: (I) reacting a mixture of the following components: (a) an aliphatic or cycloaliphatic hydroxyl-containing material, (b) an epihalohydrin, (c) a stoichiometric excess of a base compound or basic acting substance, (d) a catalyst, and (e) optionally, a solvent; wherein the reacting step (I) is carried out under reaction conditions sufficient to form a crude aliphatic or cycloaliphatic epoxy resin composition product in the resultant reaction mixture; (II) neutralizing the resultant reaction mixture of step (I) containing the crude aliphatic or cycloaliphatic epoxy resin composition product with a phosphate neutralizing agent sufficient to partially neutralize the base or basic acting substance and to form a neutralized fluid medium containing aliphatic or cycloaliphatic epoxy resin composition product; (III) removing at least a portion of unreacted epihalohydrin from the reaction mixture of step (II); and (IV) subjecting the reaction mixture of step (III) above to a separation process to recover the aliphatic or cycloaliphatic epoxy resin composition product from the neutralized fluid medium; wherein the aliphatic or cycloaliphatic epoxy resin composition product yield is greater than about 70 percent.
摘要:
Cured epoxy resins are widespread because of the excellent mechanical and chemical properties of cured epoxy resins. Epoxy resins based on bisphenol A diglycidyl ether or bisphenol F diglycidyl ether are usually used, but said epoxy resins are problematic for many fields because of the endocrine effect of said epoxy resins. The invention relates to glycidyl ethers of lime-based diols and/or polyols and curable epoxy resin compositions based on said glycidyl ethers as an alternative to bisphenol A diglycidyl ether or bisphenol F diglycidyl ether and the epoxy resin compositions based on bisphenol A diglycidyl ether or bisphenol F diglycidyl ether.
摘要:
The present invention relates to an alkoxy silyl-based epoxy compound exhibiting excellent heat resistant characteristics in a composite, and more particularly, exhibiting a low coefficient of thermal expansion (CTE) and the effect of significantly increasing the glass transition temperature in a composite and eliminating the necessity of a separate silane coupling agent. The present invention also relates to a composition comprising the compound, to a cured product thereof, to the use thereof and to a method for preparing an epoxy compound comprising an alkoxy silyl group. Thus, according to the present invention, provided are an epoxy compound comprising an epoxy group and an alkoxy silyl group, a composition comprising the epoxy compound and a curing agent, a filler and/or a reaction catalyst, a cured product thereof and the use thereof such as in an electronic component or the like. The epoxy composition comprising an epoxy compound having a novel alkoxy silyl group according to the present invention is obtained by a chemical bond resulting from a chemical reaction between the alkoxy silyl group and a filler (fiber and/or particle) and a chemical reaction between alkoxy silyl groups in a composite and/or a cured product, thus exhibiting effects of improved heat resistant characteristics, that is, a lower CTE and a higher glass transition temperature or no glass transition temperature (hereinafter, referred to as 'Tg-less') in an epoxy composite. Furthermore, the cured product comprising an epoxy compound having an alkoxy silyl group according to the present invention exhibits excellent flame resistance by introducing the alkoxy silyl group thereto.
摘要:
An epoxy resin composition including at least one epoxy resin having the Formula (I) where a is an integer from 0 to 5, x is an integer from 3 to 15, y is an integer from 5 to 30, is 0 or one, b is an integer from 3 to 10, c is an integer from one to 6, R 1 is a C 6 to C 20 cycloalkylene group, and R 2 is a saturated C 2 to C 20 aliphatic hydrocarbon group or a saturated C 5 to C 20 cycloaliphatic hydrocarbon group; a process for preparing the epoxy resin composition; and a curable coating composition comprising the epoxy resin composition.
摘要:
The present invention relates to an alkoxy silyl-based epoxy compound exhibiting excellent heat resistant characteristics in a composite, and more particularly, exhibiting a low coefficient of thermal expansion (CTE) and the effect of significantly increasing the glass transition temperature in a composite and eliminating the necessity of a separate silane coupling agent. The present invention also relates to a composition comprising the compound, to a cured product thereof, to the use thereof and to a method for preparing an epoxy compound comprising an alkoxy silyl group. Thus, according to the present invention, provided are an epoxy compound comprising an epoxy group and an alkoxy silyl group, a composition comprising the epoxy compound and a curing agent, a filler and/or a reaction catalyst, a cured product thereof and the use thereof such as in an electronic component or the like. The epoxy composition comprising an epoxy compound having a novel alkoxy silyl group according to the present invention is obtained by a chemical bond resulting from a chemical reaction between the alkoxy silyl group and a filler (fiber and/or particle) and a chemical reaction between alkoxy silyl groups in a composite and/or a cured product, thus exhibiting effects of improved heat resistant characteristics, that is, a lower CTE and a higher glass transition temperature or no glass transition temperature (hereinafter, referred to as 'Tg-less') in an epoxy composite. Furthermore, the cured product comprising an epoxy compound having an alkoxy silyl group according to the present invention exhibits excellent flame resistance by introducing the alkoxy silyl group thereto.