公开(公告)号：EP2041776A2

公开(公告)日：2009-04-01

申请号：EP07810054.2

申请日：2007-06-29

申请人： FujiFilm Electronic Materials USA, Inc.

发明人： KNEER, Emil

IPC分类号： H01L21/02

CPC分类号： C23G1/103 ,  C11D1/54 ,  C11D3/046 ,  C11D3/2075 ,  C11D3/2082 ,  C11D3/2086 ,  C11D3/245 ,  C11D11/0047 ,  G03F7/422 ,  H01L21/02063 ,  H01L21/02071

摘要： The present disclosure provides a non-corrosive cleaning composition that is useful for removing residues from a semiconductor substrate. The composition can comprise water, at least one hydrazinocarboxylic acid ester, at least one water soluble carboxylic acid, optionally, at least one fluoride-containing compound, and, optionally, at least one corrosion inhibitor not containing a carboxyl group. The present disclosure also provides a method of cleaning residues from a semiconductor substrate using the non-corrosive cleaning composition.

公开(公告)号：EP2041776A4

公开(公告)日：2010-08-18

申请号：EP07810054

申请日：2007-06-29

申请人： FUJIFILM ELECTRONIC MATERIALS

发明人： KNEER EMIL

IPC分类号： H01L21/02

CPC分类号： C23G1/103 ,  C11D1/54 ,  C11D3/046 ,  C11D3/2075 ,  C11D3/2082 ,  C11D3/2086 ,  C11D3/245 ,  C11D11/0047 ,  G03F7/422 ,  H01L21/02063 ,  H01L21/02071