利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

5 条记录 (耗时 0.006 秒)

    INTEGRATED HEAT DISSIPATION MODULE STRUCTURE
    4.
    发明公开
    INTEGRATED HEAT DISSIPATION MODULE STRUCTURE 审中-实审

    公开(公告)号：EP4425544A1

    公开(公告)日：2024-09-04

    申请号：EP23171985.7

    申请日：2023-05-08

    申请人： Top Rank Technology Limited

    发明人： WANG, TIEN-LAI ,  WANG, TZU-YU ,  WANG, CHENG-YU ,  LEE, MENG-YU

    IPC分类号： H01L23/427 ,  F28D15/02

    CPC分类号： H01L23/427 ,  F28D15/046 ,  F28F3/022 ,  F28F2275/0620130101 ,  F28F2255/1820130101 ,  F28F21/085

    摘要： An integrated heat dissipation module structure (10) includes a metallic top cover (100), a metallic bottom cover (200), a working space (300), capillary structures (400) and a working fluid in the working space (300). The top cover (100) includes oppositely an outer heat-dissipating surface (110) having a plurality of columnar heat dissipation structures (111) protruding therefrom and an inner condensation surface (120) surrounded by a top frame (122). The inner condensation surface (120) has parallel top grooves (121). The bottom cover (200) includes oppositely an outer heat-absorption surface (210) having screw holes (211) for locking electronic elements and an inner evaporation surface (220) surrounded by a bottom frame (222). The inner evaporation surface (220) has parallel bottom grooves (221), protrusive supporting structures (224) disposed between the bottom grooves (221), and screw-hole protrusions (225) corresponding to the screw holes (221). The capillary structures (500) are disposed within the bottom grooves (221) or both the bottom (221) and top (121) grooves. The working fluid is in the working space (300) and the capillary structures (500).