ELECTRONIC DEVICE
    1.
    发明公开
    ELECTRONIC DEVICE 审中-实审

    公开(公告)号:EP4408143A2

    公开(公告)日:2024-07-31

    申请号:EP24175841.6

    申请日:2021-09-22

    发明人: LIN, Chun-Hsien

    IPC分类号: H10K59/131

    摘要: An electronic device includes a signal line, a semiconductor, a first insulation layer and a second insulation layer. The semiconductor is electrically connected to the signal line. The first insulation layer is disposed on the signal line. The second insulation layer is disposed on the first insulation layer. The first insulation layer includes a first hole, and the first hole overlaps a part of the signal line. The second insulation layer includes a second hole, and the first hole and the second hole at least partially overlap. A width of the second hole is less than a width of the first hole. Therefore, the design of the repairing structure is simple, or the repairing time may be decreased, so as to increase the convenience of use.