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公开(公告)号:EP4408143A2
公开(公告)日:2024-07-31
申请号:EP24175841.6
申请日:2021-09-22
申请人: InnoLux Corporation
发明人: LIN, Chun-Hsien
IPC分类号: H10K59/131
CPC分类号: G02F1/1309 , G02F1/136259 , G02F1/136272 , G02F2201/50620130101 , H10K59/122 , H10K59/124 , H10K59/131 , H10K71/861
摘要: An electronic device includes a signal line, a semiconductor, a first insulation layer and a second insulation layer. The semiconductor is electrically connected to the signal line. The first insulation layer is disposed on the signal line. The second insulation layer is disposed on the first insulation layer. The first insulation layer includes a first hole, and the first hole overlaps a part of the signal line. The second insulation layer includes a second hole, and the first hole and the second hole at least partially overlap. A width of the second hole is less than a width of the first hole. Therefore, the design of the repairing structure is simple, or the repairing time may be decreased, so as to increase the convenience of use.
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公开(公告)号:EP3851908B1
公开(公告)日:2024-09-04
申请号:EP19812889.4
申请日:2019-05-16
IPC分类号: G02F1/1362 , H01L27/12 , G02F1/1345
CPC分类号: H01L27/124 , G02F1/13458 , G02F1/13452 , G02F1/136263 , G02F2201/50620130101
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公开(公告)号:EP3988993B1
公开(公告)日:2024-06-26
申请号:EP21198285.5
申请日:2021-09-22
IPC分类号: G02F1/13 , G02F1/1362 , H10K59/131
CPC分类号: G02F1/1309 , G02F1/136259 , G02F1/136272 , G02F2201/50620130101 , H10K59/122 , H10K59/124 , H10K59/131 , H10K71/861
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