Workpiece positioning method and apparatus
    1.
    发明公开
    Workpiece positioning method and apparatus 审中-公开
    Werkstückpositionierungsverfahrenund -vorrichtung

    公开(公告)号:EP2503420A1

    公开(公告)日:2012-09-26

    申请号:EP11275045.0

    申请日:2011-03-23

    申请人: MBDA UK LIMITED

    摘要: A method of relatively positioning a workpiece and a reference axis comprising effecting relative displacements of the workpiece and the reference axis along orthogonal axes so that an intersection of the reference axis with the workpiece is moved at substantially constant speed along a curvilinear path.
    The method is particularly applicable to SEE sensitivity mapping of a microchip memory using a pulsed laser, relative to the axis of which the chip is moved in a spiral path.

    摘要翻译: 一种相对定位工件和参考轴线的方法,包括沿着正交轴线实现工件和参考轴线的相对位移,使得参考轴线与工件的交点沿着曲线路径以基本恒定的速度移动。 该方法特别适用于使用脉冲激光器的微芯片存储器的相对于芯片以螺旋路径移动的轴线的SEE灵敏度映射。

    A method for milling grooves in bored workpieces
    2.
    发明公开
    A method for milling grooves in bored workpieces 有权
    Verfahren zumFräsenvon Nuten在gebohrtenWerkstücken

    公开(公告)号:EP1868054A1

    公开(公告)日:2007-12-19

    申请号:EP06425400.6

    申请日:2006-06-14

    申请人: VIGEL S.p.A.

    IPC分类号: G05B19/41 B23Q15/14

    摘要: A numerical control unit issues a sequence of instructions for causing the spindle of a cutter disk in a tool machine to perform successive straight displacements approximating a spiral of Archimedes, with a predetermined angle step from one point to the next, and issues one or more ADIS instructions for merging each of said straight displacements with the next. The spiral path is such that the cutter disk will progressively shave a chip of a predetermined thickness over several revolutions, until it its cutting edge is near the intended groove bottom. The tool is then caused to follow a merging path leading to a final point lying on the intended groove bottom, and finally is caused to follow a full circular path coaxial to the bore starting from the final point.

    摘要翻译: 数字控制单元发出一系列指令,使工具机中的刀盘的主轴能够以从一个点到下一个点的预定角度步长执行近似阿基米德螺旋的连续的直线位移,并且发出一个或多个ADIS 用于将所述直线位移中的每一个与下一个合并的指令。 螺旋路径使得切割盘将逐渐地刮擦预定厚度的芯片几圈,直到其切割边缘靠近预期的凹槽底部。 然后使该工具沿着通向位于预定凹槽底部的最终点的合并路径,并且最终导致从最终点开始沿着与孔同轴的完整圆形路径。