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    Method of and apparatus for dynamic alignment of substrates
    2.
    发明公开
    Method of and apparatus for dynamic alignment of substrates 有权
    用于基材的动态调整的方法和装置

    公开(公告)号：EP1102311A3

    公开(公告)日：2004-09-15

    申请号：EP00310351.2

    申请日：2000-11-22

    申请人： LAM RESEARCH CORPORATION

    发明人： Mooring, Benjamin W. ,  Freund, Charles W.

    IPC分类号： H01L21/00

    CPC分类号： G05B19/401 ,  G05B19/4083 ,  G05B2219/36405 ,  G05B2219/37283 ,  G05B2219/37512 ,  G05B2219/45031 ,  G05B2219/49299 ,  H01L21/681 ,  H01L21/682

    摘要： A wafer is transported on a blade of a robot and along a path through a port and into a module of semiconductor manufacturing equipment. The port has a transverse axis that intersects the path. Dynamic alignment determines the position of the center of the wafer with respect to the center of the blade as the wafer is transported, and uses two through-beam sensors positioned along the transverse axis according to latency characteristics of the sensors. The positioning of the sensors assures that the moving wafer will break or make a beam of a first of the sensors and that the first sensor will generate a first transition signal before the moving wafer will break or make a beam of a second of the sensors and before the second sensor generates a second transition signal. The dynamic alignment may be performed with respect to wafers having different sizes. One of the sensors is positioned for operations with respect to both sizes of wafers, whereas the second of the sensors operates and is positioned along the transverse axis for only one size wafer, and a third of the sensors operates and is positioned along the transverse axis for only the other size wafer. Three sensors may be provided for the port at each facet of each module of the semiconductor equipment. Logic circuitry processes the transition signals from appropriate ones of the sensors to identify the particular one of the ports through which the wafer is being transported. The detected position information (e.g., having possible misalignment) is then used by the robot when the wafer is subsequently positioned into a given chamber. The subsequent positioning therefore compensates for any misalignment and ensures accurately placed wafers.

    Verfahren und Vorrichtung zur Datenübertragung zwischen einer Verarbeitungseinheit und mehreren Positionsmesseinrichtungen
    4.
    发明公开
    Verfahren und Vorrichtung zur Datenübertragung zwischen einer Verarbeitungseinheit und mehreren Positionsmesseinrichtungen 有权
    为处理单元和多个位置测量设备之间的数据传输的方法和装置

    公开(公告)号：EP1408386A2

    公开(公告)日：2004-04-14

    申请号：EP03019220.7

    申请日：2003-08-26

    申请人： Dr. Johannes Heidenhain GmbH

    发明人： Bratzdrum, Erwin

    IPC分类号： G05B19/408

    CPC分类号： G05B19/408 ,  G05B2219/37494 ,  G05B2219/37512 ,  G05B2219/37526 ,  G05B2219/37532

    摘要： Es wird ein Verfahren und eine Vorrichtung zur Datenübertragung zwischen einer Verarbeitungseinheit und mehreren Positionsmesssystem angegeben, die in einer Linienbus-Topologie miteinander verbunden sind. Zur zeitgleichen Abarbeitung eines Positionsdaten-Anforderungssignals in den Positionsmesseinrichtungen wird jeweils für jede Positionsmesseinrichtung ein spezifischer Verzögerungs-Korrekturwert berücksichtigt, so dass ab dem Auftreten des Positionsdaten-Anforderungssignals auf Seiten der Verarbeitungseinheit bis zur zeitgleichen Abarbeitung des Positionsdaten-Anforderungssignals in allen Positionsmesseinrichtungen die jeweils gieiche Verzögerungszeit resultiert (Figur 1).

    摘要翻译： 该方法涉及在位置测量装置（20,30,40）的位置的数据请求信号的同时处理考虑一个特定的延迟校正值的由位置测量装置，从而没有从一个请求信号在发生出现相同的延迟 所述处理单元（10）到所述请求信号的同时处理在所有位置测量装置因此独立claimsoft包括用于执行以下操作：为一个处理单元和多个位置测量设备之间的数据传输（a）中的装置。

    Method of and apparatus for determining substrate offset using optimization techniques
    5.
    发明公开
    Method of and apparatus for determining substrate offset using optimization techniques 有权
    Verfahren undGerätzur Entscheidung einer Substratsverspetchiebung mit Optimierungsmethoden

    公开(公告)号：EP1102137A2

    公开(公告)日：2001-05-23

    申请号：EP00310347.0

    申请日：2000-11-22

    申请人： LAM RESEARCH CORPORATION

    发明人： Mooring, Benjamin W.

    IPC分类号： G05B19/408 ,  H01L21/00

    CPC分类号： G05B19/401 ,  G05B19/4083 ,  G05B2219/36405 ,  G05B2219/37283 ,  G05B2219/37512 ,  G05B2219/45031 ,  G05B2219/49299 ,  H01L21/681 ,  H01L21/682

    摘要： Dynamic alignment of a wafer with a support blade that carries the wafer is provided by making a determination of an approximate value of an offset of the wafer with respect to a desired location of the wafer in a module. This determination is in terms of a statement of an optimization program, which effectively keeps an offset computation time period within a wafer transfer time period. By a method, and by programming a computer, the wafer is picked up from a first location using an end effector and the end effector is moved to transfer the picked up wafer from the first location past a set of sensors to produce sensor data. In the event of an unknown offset of a wafer, the picking up operation results in the picked up wafer being misaligned with respect to a desired position of the picked up wafer on the end effector. When the desired location corresponds to original target coordinates to which the end effector normally moves, the original target coordinates are modified to compensate for the approximate value of the offset. The end effector is then caused to place the picked up wafer at the modified target coordinates to compensate for the unknown offset and the misalignment. By determining the amount of such wafer offset using the optimization program, the probability of convergence to a precise value of the offset is higher than with non-optimization programs.

    摘要翻译： 通过确定晶片相对于晶片在模块中的期望位置的偏移的近似值来提供晶片与承载晶片的支撑刀片的动态对准。 该确定是根据优化程序的说明，其有效地保持晶片传送时间段内的偏移计算时间段。 通过一种方法，并且通过对计算机进行编程，使用末端执行器从第一位置拾取晶片，并且移动末端执行器以将所拾取的晶片从第一位置传送通过一组传感器以产生传感器数据。 在晶片的未知偏移的情况下，拾取操作导致拾取晶片相对于末端执行器上的拾取晶片的期望位置不对准。 当所需位置对应于末端执行器正常移动到的原始目标坐标时，原始目标坐标被修改以补偿偏移的近似值。 然后使端部执行器将拾取的晶片放置在修改的目标坐标处以补偿未知偏移和未对准。 通过使用优化程序确定这种晶片偏移的量，收敛到偏移的精确值的概率高于非优化程序。

    Method for dynamic alignment of substrates
    7.
    发明公开
    Method for dynamic alignment of substrates 有权
    弗雷泽伦·祖尔·弗兰克斯

    公开(公告)号：EP1698955A1

    公开(公告)日：2006-09-06

    申请号：EP06008154.4

    申请日：2000-11-22

    申请人： LAM RESEARCH CORPORATION

    发明人： Mooring, Benjamin W. ,  Freund, Charles W.

    IPC分类号： G05B19/408 ,  H01L21/00 ,  G05B19/401 ,  G05B19/402

    CPC分类号： G05B19/401 ,  G05B19/4083 ,  G05B2219/36405 ,  G05B2219/37283 ,  G05B2219/37512 ,  G05B2219/45031 ,  G05B2219/49299 ,  H01L21/681 ,  H01L21/682

    摘要： A method for calibrating a system generates data indicating the position of a wafer relative to a blade of a wafer transport robot. The method comprises the operations of: mounting the wafer transport robot adjacent to semiconductor manufacturing equipment having a port, the blade being movable by the robot through the port along a transport axis; securing a calibration wafer to a blade at a position centred with respect to the blade, the calibration wafer having a known radius, the calibration wafer having a leading edge during movement for blade carrying the calibration wafer, and a trailing edge during movement; providing a sensor at an unknown location on a port axis that extends in the port transverse to the transport axis, the sensor being in a position to be tripped first by the presence of the leading edge so that the sensor generates a first data item, the sensor being in a position to be tripped second by the absence of the wafer following the trailing edge so that the sensor generates a second data item; causing the robot to move the calibration wafer on the transport axis and through the port past the sensor so that the sensor generates the first and second data items; and using the radius of the calibration wafer and the first and second data items to determine the distance from the transfer axis of the unknown location of the sensor on the port axis.

    摘要翻译： 用于校准系统的方法产生指示晶片相对于晶片传送机器人的刀片的位置的数据。 该方法包括以下操作：将晶片传送机器人安装在具有端口的半导体制造设备附近，刀片可由机器人沿着输送轴通过端口移动; 将校准晶片固定在相对于叶片中心的位置处的刀片，所述校准晶片具有已知的半径，所述校准晶片在运动期间具有前缘，用于携带所述校准晶片的刀片和在运动期间的后缘; 在端口轴线处的未知位置处提供传感器，该传感器在端口中横向于传送轴线延伸，传感器处于首先通过前缘的存在而跳闸的位置，使得传感器产生第一数据项， 传感器处于通过在后缘之后不存在晶片而被跳闸的位置，使得传感器产生第二数据项; 导致机器人移动校准晶片在传输轴上并通过端口经过传感器，使得传感器产生第一和第二数据项; 并且使用校准晶片的半径和第一和第二数据项来确定与端口轴上的传感器的未知位置的传送轴的距离。

    Method of and apparatus for determining substrate offset using optimization techniques
    8.
    发明公开
    Method of and apparatus for determining substrate offset using optimization techniques 有权
    Verfahren undGerätzur Entscheidung einer Substratsverspetchiebung mit Optimierungsmethoden

    公开(公告)号：EP1102137A3

    公开(公告)日：2003-10-15

    申请号：EP00310347.0

    申请日：2000-11-22

    申请人： LAM RESEARCH CORPORATION

    发明人： Mooring, Benjamin W.

    IPC分类号： G05B19/408 ,  H01L21/00 ,  G05B19/401 ,  G05B19/402

    CPC分类号： G05B19/401 ,  G05B19/4083 ,  G05B2219/36405 ,  G05B2219/37283 ,  G05B2219/37512 ,  G05B2219/45031 ,  G05B2219/49299 ,  H01L21/681 ,  H01L21/682

    摘要： Dynamic alignment of a wafer with a support blade that carries the wafer is provided by making a determination of an approximate value of an offset of the wafer with respect to a desired location of the wafer in a module. This determination is in terms of a statement of an optimization program, which effectively keeps an offset computation time period within a wafer transfer time period. By a method, and by programming a computer, the wafer is picked up from a first location using an end effector and the end effector is moved to transfer the picked up wafer from the first location past a set of sensors to produce sensor data. In the event of an unknown offset of a wafer, the picking up operation results in the picked up wafer being misaligned with respect to a desired position of the picked up wafer on the end effector. When the desired location corresponds to original target coordinates to which the end effector normally moves, the original target coordinates are modified to compensate for the approximate value of the offset. The end effector is then caused to place the picked up wafer at the modified target coordinates to compensate for the unknown offset and the misalignment. By determining the amount of such wafer offset using the optimization program, the probability of convergence to a precise value of the offset is higher than with non-optimization programs.

    摘要翻译： 晶片在机器人的刀片上并且沿着通过端口的路径被输送到半导体制造设备的模块中。 该端口具有与该路径相交的横轴。 当晶片被输送时，动态对准确定晶片的中心相对于叶片的中心的位置，并且根据传感器的延迟特性使用沿横轴定位的两个通过光束的传感器。 传感器的定位确保移动的晶片将破坏或制造第一传感器的光束，并且第一传感器将在移动的晶片断裂或制造第二传感器的光束之前产生第一转换信号，并且 在第二传感器产生第二转换信号之前。 可以相对于具有不同尺寸的晶片执行动态对准。 传感器中的一个被定位用于相对于两种尺寸的晶片的操作，而第二传感器操作并且沿着横向轴线定位仅用于一个尺寸的晶片，并且三分之一的传感器操作并且沿横轴 仅用于其他尺寸的晶片。 可以为半导体设备的每个模块的每个面处的端口提供三个传感器。 逻辑电路处理来自适当传感器的转换信号，以识别晶片通过其传输的特定端口。 当晶片随后定位到给定的室中时，机器人使用检测到的位置信息（例如，具有可能的未对准）。 因此，随后的定位补偿任何未对准并确保准确放置的晶片。