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公开(公告)号：EP2272628B1
公开(公告)日：2015-05-13
申请号：EP10168734.1
申请日：2010-07-07
发明人： Numata, Atsushi
CPC分类号： B24B49/00 , B23K26/03 , B23K26/082 , B23K26/36 , B23K26/40 , B23K2203/50 , G05B19/4163 , G05B2219/37602 , G05B2219/45157 , G05B2219/49093 , G05B2219/49103 , H01J2237/31749
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公开(公告)号：EP2272628A3
公开(公告)日：2014-02-19
申请号：EP10168734.1
申请日：2010-07-07
发明人： Numata, Atsushi
CPC分类号： B24B49/00 , B23K26/03 , B23K26/082 , B23K26/36 , B23K26/40 , B23K2203/50 , G05B19/4163 , G05B2219/37602 , G05B2219/45157 , G05B2219/49093 , G05B2219/49103 , H01J2237/31749
摘要： Provided is a processing method capable of accurately grasping a removal rate and coping with processing of an optical device or an optical device molding die, for which high shape accuracy is required. An ion beam as a tool is caused to scan a workpiece as a dummy work, and a dwell time of the tool at this time is changed based on a linear function with respect to a scanning position thereof and a removal rate with respect to the continuously changed dwell time is grasped based on an actually formed removal shape. The dwell time of the tool is changed based on the linear function with respect to the scanning position, and hence a removal rate based on the actual removal shape can be acquired continuously from a case where a scanning speed is fast to a case where the scanning speed is slow.
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公开(公告)号：EP2272628A2
公开(公告)日：2011-01-12
申请号：EP10168734.1
申请日：2010-07-07
发明人： Numata, Atsushi
CPC分类号： B24B49/00 , B23K26/03 , B23K26/082 , B23K26/36 , B23K26/40 , B23K2203/50 , G05B19/4163 , G05B2219/37602 , G05B2219/45157 , G05B2219/49093 , G05B2219/49103 , H01J2237/31749
摘要： Provided is a processing method capable of accurately grasping a removal rate and coping with processing of an optical device or an optical device molding die, for which high shape accuracy is required. An ion beam as a tool is caused to scan a workpiece as a dummy work, and a dwell time of the tool at this time is changed based on a linear function with respect to a scanning position thereof and a removal rate with respect to the continuously changed dwell time is grasped based on an actually formed removal shape. The dwell time of the tool is changed based on the linear function with respect to the scanning position, and hence a removal rate based on the actual removal shape can be acquired continuously from a case where a scanning speed is fast to a case where the scanning speed is slow.
摘要翻译： 提供了一种能够精确地掌握去除率并应对需要高形状精度的光学装置或光学装置成型模具的处理的处理方法。 使作为工具的离子束作为虚拟作业扫描工件，此时工具的停留时间基于相对于其扫描位置的线性函数和相对于连续的线性函数而改变 基于实际形成的去除形状来掌握改变的停留时间。 基于相对于扫描位置的线性函数来改变工具的停留时间，因此可以从扫描速度快的情况下连续地获取基于实际去除形状的去除速率到扫描的情况 速度很慢
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