公开(公告)号：EP4372806A1

公开(公告)日：2024-05-22

申请号：EP22315290.1

申请日：2022-11-15

申请人： GE Energy Power Conversion Technology Ltd

发明人： Clavier, Philippe ,  Baerd, Henri ,  Hamelin, Dimitri ,  Lenherr, Christian

IPC分类号： H01L23/467 ,  H01L23/40 ,  H01L23/473 ,  H01L25/11

CPC分类号： H01L23/473 ,  H01L23/467 ,  H01L23/4012 ,  H01L2023/402520130101 ,  H01L25/117

摘要： The heatsink (16, 17, 18, 19, 20) for cooling at least one electronic device package (12, 13, 14, 15) having an upper contact surface (12a, 13a, 14a, 15a) and a lower contact surface (12b, 13b, 14b, 15b) is proposed.
The heat sink comprises a first cooling piece (24) and a support piece (23).
The support piece (23) and the first cooling piece (24) are two independent pieces so that the interface between the first surface of the support piece and the second surface of the first cooling piece allows a relative movement between the support piece and the first cooling piece along a direction parallel to the interface between the first cooling piece and the support piece.