MICROPOROUS ATOMIZATION ASSEMBLY AND ULTRASONIC ATOMIZATION DEVICE

    公开(公告)号:EP4230064A1

    公开(公告)日:2023-08-23

    申请号:EP22214815.7

    申请日:2022-12-20

    发明人: LIU, Changqing

    摘要: This present disclosure discloses a microporous atomization assembly (1) and an ultrasonic atomization device. The microporous atomization assembly (1) includes a microporous atomization plate (10) and a circuit board (20). The microporous atomization plate (10) is configured to atomize an aerosol-generation substrate and generate aerosols; and the circuit board (20) is flexibly electrically connected to the microporous atomization plate (10), and is configured to transmit an electrical signal of the circuit board (20) to the microporous atomization plate (10). By connecting the circuit board (20) and the microporous atomization plate (10) through a flexible material, the problems of attenuation of performance parameters of the atomization plate, poor product consistency, and a high scrap rate caused by a soldering iron heated and soldered on the microporous atomization plate (10) in the related art are resolved.