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公开(公告)号：EP4043198B1
公开(公告)日：2024-08-28
申请号：EP22154764.9
申请日：2022-02-02
IPC分类号： B32B1/08 , B32B3/04 , B32B3/10 , B32B3/14 , B32B3/16 , B32B5/08 , B32B5/12 , B32B5/26 , B32B7/05 , B32B7/12 , B32B19/02
CPC分类号： B32B1/08 , B32B3/04 , B32B3/10 , B32B3/14 , B32B3/16 , B32B5/26 , B32B5/08 , B32B5/12 , B32B7/05 , B32B7/12 , B32B2250/0220130101 , B32B2250/0320130101 , B32B2250/2020130101 , B32B19/02 , B32B2260/02320130101 , B32B2260/04620130101 , B32B2262/026920130101 , B32B2262/1020130101 , B32B2262/10120130101 , B32B2262/10520130101 , B32B2262/10620130101 , B32B2307/20420130101 , B32B2307/30420130101 , B32B2307/73820130101 , B32B2605/1820130101
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公开(公告)号：EP4411724A1
公开(公告)日：2024-08-07
申请号：EP22876451.0
申请日：2022-09-29
摘要： Provided is a sound insulation sheet that exhibits a high sound insulation effect beyond the mass law in multiple frequency bands.
The sound insulation sheet is formed to have at least a sheet member, and a convex member A and a convex member B different in shape from each other.
The convex members are arranged so as to obtain at least two peaks in a graph obtained by measuring a sound transmission loss of the sound insulation sheet, with the horizontal axis of a frequency X and the vertical axis of ΔTL (dB) obtained by the following formula (1), and to have at least two of these peaks with a height of 3 dB or more; ΔTL=TL1−TL2 wherein TL1 represents a sound transmission loss (dB) of the sound insulation sheet at the frequency X, and TL2 represents a sound transmission loss (dB) of a flat sheet having no concavo-convex structure and having the same mass as that of the sound insulation sheet and the same area as that of the sheet member at the frequency X.-
公开(公告)号：EP4306311A1
公开(公告)日：2024-01-17
申请号：EP22000181.2
申请日：2022-07-11
申请人： Knauf Gips KG
摘要： The invention refers to an areal building element, comprising a first partial element and a second partial element, each one based on a material based on at least one mineral binder. The first partial element comprises at least one first reinforcement layer, and the second partial element comprises at least one second reinforcement layer, wherein the first reinforcement layer is arranged essentially equidirectional to the first partial element, and the second reinforcement layer is arranged in a crosswise direction to the second partial element.
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公开(公告)号：EP3687788B8
公开(公告)日：2024-01-10
申请号：EP18860922.6
申请日：2018-09-26
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5.发明公开
公开(公告)号：EP4286151A1
公开(公告)日：2023-12-06
申请号：EP22177045.6
申请日：2022-06-02
申请人： Coexpair Dynamics
发明人： BERTIN, André
摘要： The present invention relates to a curved wall (1) comprising an alternation of metal (21) and composite (11, 12) layers, and to a method to produce it. The metal (21) layer is made of aligned metal strips (30) and can thus conform to any shape of the curved wall (1).
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公开(公告)号：EP4219797A1
公开(公告)日：2023-08-02
申请号：EP21872584.4
申请日：2021-09-24
申请人： University of Tsukuba , Université Grenoble Alpes , Centre National de la Recherche Scientifique , Institut Polytechnique de Grenoble
IPC分类号： C25D5/02 , C25D5/18 , H01M4/86 , H01M4/88 , H01M4/90 , H01M4/92 , H01M4/96 , H01M8/16 , B32B7/025 , C12N9/02 , C12N9/06 , C12N11/14 , B32B3/14 , C25B11/073 , G01N27/327
摘要： A structure, comprising an electroconductive substrate and a metal deposit that is disposed on the electroconductive substrate in an island-like manner.
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公开(公告)号：EP4188696A1
公开(公告)日：2023-06-07
申请号：EP21745450.3
申请日：2021-07-23
发明人： PLUGGE, Simon , KEMPF, Michael , BIEBER, Pierre , APELDORN, Thomas , KUHLMANN, René , KONIETZNY, Roman , HOFFMANN, Björn , KOPPENHAGEN, Torsten , SPROTT, Sascha
IPC分类号： B32B5/18 , B32B3/08 , B32B3/14 , H01M10/613 , H01M10/653 , H01M10/655 , H01M10/6555
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公开(公告)号：EP4129664A1
公开(公告)日：2023-02-08
申请号：EP21781514.1
申请日：2021-03-30
发明人： ISHIKAWA Fumiaki , HARA Shintaro , MORI Hiroyuki , FUKUOKA Kosei
摘要： A metal base substrate of the present invention is a metal base substrate including a metal substrate, an insulating layer laminated on one surface of the metal substrate, and a circuit layer laminated on a surface of the insulating layer opposite to the metal substrate side, in which the circuit layer is made of a metal having a semi-softening temperature of 100°C or higher and 150°C or lower, the insulating layer contains a resin, and a relationship between a thickness t (µm) of the insulating layer and an elastic modulus E (GPa)of the insulating layer at 100°C satisfies a following formula (1). 10 t / E
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9.发明公开
公开(公告)号：EP4082772A1
公开(公告)日：2022-11-02
申请号：EP21171575.0
申请日：2021-04-30
发明人： Franken, Carina , Dr. Platt, Jürgen
IPC分类号： B32B15/18 , B32B3/14 , B32B5/02 , B32B9/00 , B32B9/04 , B32B15/01 , B32B15/14 , B32B15/20 , C21D8/12 , B23K20/02 , B23K20/04 , B23K20/227 , H01F3/04
摘要： Die Erfindung betrifft ein Flachverbundteil mit mindestens einer Funktionslage (4) zumindest teilweise bestehend aus einem ferromagnetischen Werkstoff, mit mindestens einer Zusatzlage (8) zumindest teilweise bestehend aus einem nicht magnetisierbaren Werkstoff, das dadurch gekennzeichnet ist, dass die mindestens eine Zusatzlage (8) und die mindestens eine Funktionslage (4) durch eine Adhäsionsbindung (12) mit atomarer Diffusion (14) miteinander verbunden sind und/oder dass mindestens eine Funktionslage (4) eine Dicke im Bereich von 2 bis 100 µm, bevorzugt von 2 bis 60 µm, aufweist. Die Erfindung betrifft auch eine Verwendung eines solchen Flachverbundteils als Eisenkern und ein Verfahren zur Herstellung eines Flachverbundteils. Die Erfindung löst das technische Problem, ein Flachverbundteil sowie ein Verfahren zur Herstellung eines Flachverbundteils zur Verfügung zu stellen, das die für den Stand der Technik beschriebenen Nachteile verbessert und insbesondere die Effizienz der Energieumwandlung bei einer Anwendung als induktives Bauteil erhöht.
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