摘要:
The invention relates to a processing element (3a) for processing a profile-shaped or flat metallic workpiece, wherein the processing element (3a) is designed such that a plurality of similar processing elements (3a) are arrangeable one behind the other on a supporting device in the longitudinal direction of the supporting device, wherein the supporting device is circumferentially drivable and the plurality of processing elements (3a) can be guided past the workpiece for surface processing at least approximately linearly by means of the supporting device. According to the invention, there is a rectangular or block-shaped base body having bearing surfaces for bearing on the supporting device, and there are oblong ribs, protruding outward in a web-like manner, on the base body, on opposite flat longitudinal sides, which oblong ribs overlap the corresponding opposite flat longitudinal sides of the base body on an identically designed processing element (3a), which is arranged between the ribs.
摘要:
A plant for sanding/finishing components (2) made of wood, metal or the like has a sanding station (3), a feeding device (4) for feeding at least one component (2) in a continuous manner through the sanding station (3), and a robotic manipulator (9), which is provided with at least one sanding tool (12) and is configured so as to allow the sanding tool (12) to carry out the sanding of the component (2) in a continuous manner by combining the movements of the feeding device (4) with the movements of the robotic manipulator (9).
摘要:
The machine comprises an inlet area of the pieces to be grinded, a first conveyor for the pieces, the pieces rotating in a first direction starting with a horizontal laying, a first grinding area to grind a face of each piece which can be reached by a first abrasive means, a second conveyor for the piece for putting again the piece into the horizontal laying, a third conveyor of the pieces which rotate in a third direction, a second grinding area for grinding the second face of each piece opposite to the first one, the second face is available to a second abrasive means thanks to the third conveyor, a fourth conveyor of the pieces which rotate in a fourth direction opposite to the third one beginning with the laying reached through the third conveyor in order to reach a horizontal laying, an exit from the machine of the grinded pieces and brought again into the horizontal laying through the fourth conveyor.
摘要:
A method and an apparatus for machining the joint face of a work in which a joint face exhibiting high airtightness is provided by eliminating leakage due to streaks caused by abrasive grains. At the time of machining the joint face (15) of a work (31), a grinder (11) rotating about rotational axes (33, 35) substantially parallel with the joint face (15) is pressed against the joint face (15) of the work (31) and fed relatively between the grinder (11) and the work (31) in the direction substantially copying the contour of the joint face (15) while controlling the orientation of the grinder (11) or the work (31) such that the rotational axes (33, 35) of the grinder (11) is substantially orthogonal to the relative feeding direction thus grinding the joint face (15) of the work (31).
摘要:
A method of modifying a surface of a semiconductor wafer comprising the steps of: contacting said surface with a three-dimensional, textured, fixed abrasive article comprising a plurality of abrasive composites arranged in the form of a pre-determined pattern, said composites comprising a plurality of abrasive particles dispersed in a binder; and relatively moving said wafer and said fixed abrasive article in the presence of a liquid medium to modify said surface of said wafer.