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    SEALED BATTERY FUSE MODULE WITH ENERGY DISSIPATING CAP
    5.
    发明公开
    SEALED BATTERY FUSE MODULE WITH ENERGY DISSIPATING CAP 审中-公开

    公开(公告)号：EP3671801A1

    公开(公告)日：2020-06-24

    申请号：EP19212596.1

    申请日：2019-11-29

    申请人： Littelfuse, Inc.

    发明人： MANTOAN, Davide ,  TINTO, Massimiliano

    IPC分类号： H01H85/175 ,  H01H85/43 ,  H01H85/00 ,  H01H85/10 ,  H01H85/02 ,  H01H85/38

    摘要： A fuse module including a mounting block having a through-hole extending therethrough, a fuse including an upper portion disposed on a top of the mounting block and having a through-hole, a lower portion disposed on a bottom of the mounting block and having a through-hole, and a fusible element disposed adjacent a sidewall of the mounting block and connecting the upper portion to the lower portion, the fuse module further including a housing having a main body portion encasing the mounting block and the fuse, the main body portion having apertures in top and bottom surfaces thereof aligned with the through-hole of the mounting block, and a cap portion connected to the main body portion and disposed over the fusible element, the cap portion having surface features extending from an interior surface thereof for absorbing energy upon occurrence of an overcurrent condition in the fuse.

    PRINTED CIRCUIT FUSE AND METHOD FOR USE OF THE SAME
    8.
    发明公开
    PRINTED CIRCUIT FUSE AND METHOD FOR USE OF THE SAME 审中-公开

    公开(公告)号：EP3389077A1

    公开(公告)日：2018-10-17

    申请号：EP17171637.6

    申请日：2017-05-18

    申请人： Fibar Group S.A.

    发明人： Zdunek, Robert

    IPC分类号： H01H85/046 ,  H01H85/38 ,  H01H85/10 ,  H01H69/02 ,  H05K1/02 ,  H01H85/02

    摘要： A high breaking capacity printed circuit fuse comprising: a multi-layer printed circuit board 100 comprising: a first external layer 101a present at a first side of a middle layer 101b and a second external layer 101d present opposite the first external layer with respect to the middle layer; a multi-layer circuit present on the multi-layer printed circuit board 10, the multi-layer circuit forming a conductive path 102-105, which passes between said layers 101a-d; whereas said conductive path comprises: a first end 102 located on the outer side of said middle layer; a thinning 103, at the level of the first end 102 of the conductive path, which is configured to act as a fusible link; a via 104 configured to pass, from said thinning 103 via all layers 101a-d, to the external side of the second external layer 101d; a second end 105, connected at the end of said via 104, located on the external side of the second external layer 101d of the multi-layer printed circuit board; whereas a non-flammable agent 106 is present on the external side of at least the first external layer 101a, covering an outlet of said via 104.