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    METHOD FOR MANUFACTURING PROCESSED PLASTIC FILM
    3.
    发明公开
    METHOD FOR MANUFACTURING PROCESSED PLASTIC FILM 审中-实审

    公开(公告)号：EP4357479A1

    公开(公告)日：2024-04-24

    申请号：EP22824911.6

    申请日：2022-06-09

    申请人： TOYOBO CO., LTD.

    发明人： ISEKI, Kiyoshi

    IPC分类号： C23C14/02 ,  H05F3/02 ,  H05F3/04

    CPC分类号： H05F3/04 ,  H05F3/02 ,  C23C14/02

    摘要： [Problem] To provide a method for manufacturing a processed plastic film, the method comprising a charge removal step for preventing damage to a charged plastic film due to abnormal discharge and eliminating problems with plastic film travel due to electrostatic adhesion by removing the charge on the plastic film using a simple device and lowering the potential at the surface.
    [Solution] The problem can be solved by a method which is for manufacturing a processed plastic film and reduces the amount of charge on a plastic film traveling in a vacuum, the method comprising a step (step 1) for removing charge by a charge removal method in which a conductor having a radius of curvature of 1 mm or less is installed near the plastic film in the width direction of the plastic film, the shortest distance between the surface of the plastic film and the conductor is set to 2-10 mm, and the grounded conductor is used while maintaining the pressure therebetween at 8-800 Pa.

    FLOORING ARRANGEMENT FOR AN AIRCRAFT
    7.
    发明公开
    FLOORING ARRANGEMENT FOR AN AIRCRAFT 审中-公开

    公开(公告)号：EP4194195A1

    公开(公告)日：2023-06-14

    申请号：EP23155579.8

    申请日：2020-06-04

    申请人： Bombardier Inc.

    发明人： MOUPFOUMA, Fidele ,  LAVOIE, Claude ,  ELSHARKAWI, Mohamed Hassan

    IPC分类号： B32B5/18 ,  B32B15/02 ,  B32B15/04 ,  B64D11/00 ,  B64D45/02 ,  D06N7/00 ,  H05F3/02

    摘要： A flooring arrangement for an aircraft cabin and an aircraft with the flooring arrangement. The flooring arrangement at least one insulating layer for insulating the cabin; a wire mesh disposed above the at least one insulating layer; a carpet layer disposed above the wire mesh, the carpet layer and the wire mesh being in electrically conductive contact; and at least one resistive element connected to the wire mesh, the wire mesh being structured and arranged for being electrically connected to a conductive structure of the aircraft via the at least one resistive element. When the flooring arrangement is installed in the aircraft, the resistive element allows transmission, from the wire mesh to the conductive structure, of electrostatic charges developed on the carpet layer, and impedes transmission, from the conductive structure to the wire mesh, of high current events experienced by the aircraft.

    CIRCUIT BOARD MODULE
    8.
    发明公开
    CIRCUIT BOARD MODULE 审中-公开

    公开(公告)号：EP4132233A1

    公开(公告)日：2023-02-08

    申请号：EP21930896.2

    申请日：2021-03-19

    申请人： BOE Technology Group Co., Ltd. ,  Chengdu BOE Optoelectronics Technology Co., Ltd.

    发明人： YANG, Xianfeng ,  BI, Xianlei ,  LAN, Chuanyan ,  MA, Qian

    IPC分类号： H05K1/02 ,  G06F3/041 ,  H05F3/02

    摘要： A circuit board module (300), relating to the technical field of touch control, and capable of improving an anti-static capability. The circuit board module (300) comprises a touch-control chip (20), a first circuit board (10), a second circuit board (30) and at least one conductive connection portion (40), wherein the touch-control chip (20) comprises a grounding pin (22) and a plurality of signal pins (21); the first circuit board (10) is electrically connected to a touch-control display screen (200); the first circuit board (10) comprises a first grounding portion (14) and a plurality of signal pads (112); the signal pads (112) are electrically connected to the signal pins (21), such that the touch-control chip (20) is electrically connected to the touch-control display screen (200) by means of the first circuit board (10); the first grounding portion (14) is electrically connected to the grounding pin (22); the second circuit board (30) comprises a second grounding portion (32); and the at least one conductive connection portion (40) is electrically connected to the first grounding portion (14) and the second grounding portion (32).

    ANTISTATIC STRUCTURE AND AIR-CONDITIONER
    10.
    发明公开
    ANTISTATIC STRUCTURE AND AIR-CONDITIONER 审中-公开

    公开(公告)号：EP4064798A1

    公开(公告)日：2022-09-28

    申请号：EP20907078.8

    申请日：2020-08-21

    申请人： Daikin Industries, Ltd.

    发明人： HATTORI, Takayuki

    IPC分类号： H05F3/02 ,  F24F13/20 ,  F24F11/89

    摘要： An antistatic structure includes a casing (20), an element (50) disposed in the casing (20), and a first conductive member (60) disposed on an inner face of the casing (20) and configured to send static electricity to a ground (E). The first conductive member (60) is at least partially disposed around a region opposite the element (50) in the casing (20).