公开(公告)号：JP2015040154A

公开(公告)日：2015-03-02

申请号：JP2013172733

申请日：2013-08-22

Applicant: 一般財団法人ファインセラミックスセンター ,  Japan Fine Ceramics Center ,  トヨタ自動車株式会社 ,  Toyota Motor Corp

Inventor： UEDA TARO ,  TAKAHASHI SEIJI ,  OKAWA HAJIME ,  SAKAI TAKENOBU ,  AWANO HIROMOTO ,  MAEKAWA RYOSUKE ,  TAKEDA YUICHIRO ,  KUSANO YUYA

IPC: C04B35/547 ,  C01G19/00 ,  H01L21/363 ,  H01L31/06

CPC classification number: Y02E10/50

Abstract: 【課題】太陽電池用に、より低い焼成温度で焼結可能なCZTS系化合物半導体材料を提供する。【解決手段】Cu、Zn、Sn及びSを主成分とするCZTS系化合物半導体材料を、CZTS系化合物と、焼結助剤としてSn及びZnのいずれか又は双方と、を含むようにし、500〜670℃の低温での焼成により緻密な焼結体を得る。前記Sn又は、前記Znを、前記CZTS系化合物に対して、1〜9質量%、好ましくは4〜7質量%以下含有させる。また焼成温度好ましくは550〜570℃の温度、より好ましくは550〜570℃の温度で焼成する。【選択図】なし

Abstract translation: 要解决的问题：提供一种可在较低烧成温度下烧结的CZTS系化合物半导体材料，用于太阳能电池。解决方案：以Cu，Zn，Sn和S为主要成分的CZTS系化合物半导体材料为 制成包括CZTS基化合物和Sn和Zn中的一种或两种作为烧结助剂，并且通过在500至670℃的低温下烧制获得致密的烧结体。 基于CZTS系化合物的烧结体含有1〜9质量％，优选为4〜7质量％以下的Sn或Zn。 此外，将CZTS系化合物半导体材料在优选为500〜670℃，更优选在550〜570℃的烧成温度下进行烧成。

公开(公告)号：JP2014144885A

公开(公告)日：2014-08-14

申请号：JP2013013991

申请日：2013-01-29

Applicant: Toyota Motor Corp ,  トヨタ自動車株式会社

Inventor： TAKEDA YUICHIRO ,  MURAKAMI DAICHI ,  SAKAI TAKENOBU ,  SUDO HIROYUKI ,  AWANO HIROMOTO ,  MATSUNAGA TOMOYA ,  MAEKAWA RYOSUKE ,  KUSANO YUYA

IPC: C01G3/00 ,  C04B35/547 ,  H01L31/06

CPC classification number: Y02E10/50

Abstract: PROBLEM TO BE SOLVED: To provide a method of producing a CZTS compound semiconductor sintered compact, capable of producing a dense CZTS compound semiconductor sintered compact at a firing temperature lower than that in a conventional method.SOLUTION: The method of producing a CZTS compound semiconductor sintered compact includes a step of firing a compact to be sintered containing Cu, Zn, Sn, and S under an environment where a sintering additive is present. The sintering additive contains a germanium compound.

Abstract translation: 要解决的问题：提供一种生产CZTS化合物半导体烧结体的方法，其能够在低于常规方法的烧制温度下生产致密的CZTS化合物半导体烧结体。方法：制备CZTS化合物半导体的方法 烧结体包括在存在烧结添加剂的环境下烧制含有Cu，Zn，Sn和S的烧结体的工序。 烧结添加剂含有锗化合物。

公开(公告)号：JP2014091647A

公开(公告)日：2014-05-19

申请号：JP2012242320

申请日：2012-11-02

Applicant: Toyota Motor Corp ,  トヨタ自動車株式会社 ,  Osaka City Univ ,  公立大学法人大阪市立大学 ,  Japan Fine Ceramics Center ,  一般財団法人ファインセラミックスセンター

Inventor： AWANO HIROMOTO ,  SAKAI TAKENOBU ,  MATSUNAGA TOMOYA ,  MAEKAWA RYOSUKE ,  TAKEDA YUICHIRO ,  KUSANO YUYA ,  IZUNO MASATSUGU ,  KIM DAE-KWI ,  TAKAHASHI SEIJI

IPC: C01G19/00 ,  H01L31/06

CPC classification number: Y02E10/50

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of CuSnSparticles that can manufacture CuSnSparticles of uniform composition.SOLUTION: A manufacturing method of CuSnSparticles includes a mixed solution preparing step of preparing a mixed solution by mixing at least a copper ion source, a stannum ion source, a ligand that suppresses an ion-binding reaction, and water, a precursor solution preparing step of preparing a precursor solution of a pH of 2 or higher and 8 or lower by mixing at least the prepared mixed solution and a sulfur ion source, and a sealing step of putting the prepared precursor solution in a container and sealing the container with the precursor solution put therein, and a hydrothermal synthesis reaction step of carrying out a hydrothermal synthesis reaction in the sealed container.

Abstract translation: 要解决的问题：提供可制造均匀组成的CuSn颗粒的CuSn颗粒的制造方法。溶液：CuSn颗粒的制造方法包括混合溶液制备步骤，通过至少混合铜离子源，锡离子 源，抑制离子结合反应的配体和水，通过混合至少所制备的混合溶液和硫离子源，制备pH为2以上且8以下的前体溶液的前体溶液的制备步骤， 以及密封步骤，将制备的前体溶液放入容器中并将其中放置有前体溶液的容器密封，以及在密封容器中进行水热合成反应的水热合成反应步骤。

公开(公告)号：JP2014047093A

公开(公告)日：2014-03-17

申请号：JP2012190409

申请日：2012-08-30

Applicant: Toyota Motor Corp ,  トヨタ自動車株式会社 ,  Nagoya Institute Of Technology ,  国立大学法人 名古屋工業大学

Inventor： SAKAI TAKENOBU ,  AWANO HIROMOTO ,  MATSUNAGA TOMOYA ,  MAEKAWA RYOSUKE ,  TAKEDA YUICHIRO ,  KATO TAKAHIRO ,  KAWASAKI SHINJI

IPC: C01B31/02 ,  C25B1/24 ,  H01B1/04 ,  H01B13/00

Abstract: PROBLEM TO BE SOLVED: To provide an electroconductive material having a reduced electrical resistivity and a method for producing the same.SOLUTION: The electroconductive material comprises: carbon nano-tubes each having at least one open end; and iodine added to the carbon nano-tubes. The percentage of the mass of the iodine occupying in the total mass of the carbon nano-tubes and the iodine is 17% or more. The method for producing the electroconductive material comprises: a step of bringing the carbon nano-tubes each having at least one open end into contact with an electrolytic solution containing an iodine source; and a step of using the carbon nano-tubes brought into contact with the electrolytic solution for an action electrode and performing electrolytic oxidation.

Abstract translation: 要解决的问题：提供具有降低的电阻率的导电材料及其制造方法。解决方案：导电材料包括：每个具有至少一个开口端的碳纳米管; 并将碘加入到碳纳米管中。 在碳纳米管和碘的总质量中占据的碘的质量百分比为17％以上。 制造导电材料的方法包括：使具有至少一个开口端的碳纳米管与含有碘源的电解液接触的步骤; 以及使用与电解液接触的碳纳米管作用于动作电极并进行电解氧化的步骤。

公开(公告)号：JP2014011310A

公开(公告)日：2014-01-20

申请号：JP2012147030

申请日：2012-06-29

Applicant: Toyota Motor Corp ,  トヨタ自動車株式会社

Inventor： MAEKAWA RYOSUKE ,  AWANO HIROMOTO ,  MATSUNAGA TOMOYA ,  TAKEDA YUICHIRO ,  SAKAI TAKENOBU ,  KUSANO YUYA

IPC: H01L21/368 ,  H01L31/06

CPC classification number: H01L31/18 ,  C30B19/00 ,  C30B29/16 ,  H01L21/02422 ,  H01L21/02425 ,  H01L21/02472 ,  H01L21/02554 ,  H01L21/02565 ,  H01L21/02628 ,  H01L27/1225 ,  H01L31/022483 ,  H01L31/032 ,  H01L31/0322 ,  H01L31/0749 ,  Y02E10/541 ,  Y02P70/521

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor film capable of manufacturing a ZnMgO film in which an additive amount of Mg to Zn is more than 20 mol% using a liquid phase film formation method.SOLUTION: A method for manufacturing a semiconductor film comprises: a first step of preparing a mixture containing zinc hydroxide and magnesium hydroxide; a second step of attaching the mixture to a film-formed member; and a third step of heating the film-formed member attached with the mixture from 300°C to 400°C in 100/30 minutes.

Abstract translation: 要解决的问题：提供一种制造半导体膜的方法，所述半导体膜能够使用液相成膜方法制造其中Mg与Zn的添加量大于20mol％的ZnMgO膜。制造方法 半导体膜包括：制备含有氢氧化锌和氢氧化镁的混合物的第一步骤; 将混合物附着到膜形成部件的第二步骤; 以及在100/30分钟内将从300℃至400℃附着的混合物的成膜部件加热的第三步骤。

公开(公告)号：JP2010225635A

公开(公告)日：2010-10-07

申请号：JP2009068204

申请日：2009-03-19

Applicant: TOYOTA MOTOR CORP

Inventor： MAEKAWA RYOSUKE

IPC: H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a solder joint method for avoiding a stress concentration by a simple method and forming a solder layer with high durability against a cooling cycle. SOLUTION: The soldering method for soldering a second member (a semiconductor element 1) to a first member (a circuit substrate 2) includes: a first process for arranging a solder alloy 4' on the first member, arranging a molding die 20 having a side surface 21 projected toward the solder alloy 4' at the circumference of the solder alloy 4', and arranging the second member on the molding die 20; and a second process for fusing the solder alloy 4' by heating so as to perform soldering. COPYRIGHT: (C)2011,JPO&INPIT