The chemical mechanical polishing aqueous dispersion, a manufacturing method and a chemical mechanical polishing method of the chemical mechanical polishing aqueous dispersion

    公开(公告)号:JP5327430B2

    公开(公告)日:2013-10-30

    申请号:JP2008164121

    申请日:2008-06-24

    Abstract: PROBLEM TO BE SOLVED: To provide: an aqueous dispersion for chemical mechanical polishing, which is not repeatedly used through a simple process while having superior polishing performance for a metal film of copper etc., a barrier metal film of tantalum etc., and an insulating film; a method of manufacturing the aqueous dispersion for the chemical mechanical polishing; and a method for the chemical mechanical polishing. SOLUTION: The inventors find that the subject to be solved can be solved by using (A) abrasive grains; (B) organic acid; and (C) the aqueous dispersion for chemical mechanical polishing, which contains one or more kinds of atoms selected from a group of T, Ti, and Ru, wherein the ratio Rmax/Rmin of the short diameter Rmin to the long diameter Rmax of the abrasive grains is 1.0 to 1.5 and the concentration of the (C) component is 1.0×10 1 to 1.0×10 3 p.p.m. COPYRIGHT: (C)2010,JPO&INPIT

    The compositions and films containing carbon nanotube

    公开(公告)号:JP5176800B2

    公开(公告)日:2013-04-03

    申请号:JP2008230254

    申请日:2008-09-08

    Abstract: PROBLEM TO BE SOLVED: To provide a composition capable of forming a film containing carbon nanotubes without spoiling electric properties and optical properties retained essentially in the carbon nanotubes and to provide a film containing the carbon nanotubes obtained from the composition. SOLUTION: The composition containing the carbon nanotubes includes (A) carbon nanotubes, (B) one or more kinds of organic polymers selected from the group consisting of a polyether, a polyester, a polycarbonate, a polyanhydride, a polystylene-based polymer and a poly (meth)acrylate and (C) a solvent. COPYRIGHT: (C)2010,JPO&INPIT

Patent Agency Ranking