公开(公告)号：JP2011057577A

公开(公告)日：2011-03-24

申请号：JP2009206561

申请日：2009-09-08

Applicant: Air Water Inc ,  エア・ウォーター株式会社

Inventor： TAKAHASHI KO ,  MURATA SEIKI ,  SONE YOSHIHISA

IPC: C07F7/18 ,  C07B61/00 ,  C08G59/50

Abstract: PROBLEM TO BE SOLVED: To provide a novel aryloxysilane compound and a manufacturing method of the same, and a curing agent composed of the same for an epoxy resin useful for applications such as a liquid sealing material, an underfill agent, an electroconductive paste and the like, an epoxy resin composition comprising the same and a cured product thereof.
SOLUTION: The aryloxysilane compound is represented by formula (1) (wherein Ar is a phenylene group or a naphthalene group). The compound is manufactured from a bifunctional silane compound of formula (4) and an aromatic compound of formula (5). The curing agent for an epoxy resin comprises the compound. The epoxy resin composition comprises the epoxy resin curing agent. The cured product of the same is also provided.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：为了提供新的芳氧基硅烷化合物及其制备方法，以及由它们组成的用于环氧树脂的固化剂可用于液体密封材料，底部填充剂，导电性 糊剂等，包含该树脂组合物的环氧树脂组合物和其固化产物。 解决方案：芳氧基硅烷化合物由式（1）表示（其中Ar是亚苯基或萘基）。 该化合物由式（4）的双官能硅烷化合物和式（5）的芳族化合物制备。 环氧树脂的固化剂包含该化合物。 环氧树脂组合物包含环氧树脂固化剂。 还提供了其固化产物。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010189296A

公开(公告)日：2010-09-02

申请号：JP2009033922

申请日：2009-02-17

Applicant: Air Water Inc ,  エア・ウォーター株式会社

Inventor： TAKAHASHI KO ,  SONE YOSHIHISA

IPC: C07C271/58 ,  C08G59/62 ,  C09D7/12 ,  C09D163/00 ,  C09J11/06 ,  C09J163/00 ,  C09K3/10 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide a phenol derivatization type compound useful for epoxy resin curing agents, a method for producing the same, an epoxy resin curing agent which has high compatibility with an epoxy resin composition and gives an epoxy resin cured product having a high glass transition temperature, and an epoxy resin composition containing the curing agent and an epoxy resin.
SOLUTION: The phenol derivatization type compound is a phenolic compound of formula (1) [wherein Ar
1 and Ar
2 are each a phenylene group of formula (2) or a naphthalene group of formula (3); X is a direct bond, a divalent hydrocarbon group which may contain an atom of a different kind, O, S or SO
2 ; R
1 to R
3 are each a 1-15C hydrocarbon group or a hydroxy group; v, w, and x are each 0-3; and n is not less than 0] having two or more hydroxy groups which are substituted with a substituent of formula (4) (wherein R
4 is a 1-15C hydrocarbon group) at a substitution rate of 10 to less than 100%. The method for producing the same, the epoxy resin curing agent composed of the same, and the epoxy resin composition including the curing agent are provided.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种可用于环氧树脂固化剂的苯酚衍生化合物，其制备方法，与环氧树脂组合物相容性高并赋予环氧树脂固化产物的环氧树脂固化剂 玻璃化转变温度高，含有固化剂和环氧树脂的环氧树脂组合物。 苯酚衍生化合物是式（1）的酚类化合物[其中Ar 1 和Ar 2 分别是式（2）的亚苯基， 或式（3）的萘基; X是直接键合，可以含有不同种类的原子的二价烃基，O，S或SO 2 ; R 1 至R 3 分别为1-15C烃基或羟基; v，w和x各自为0-3; 并且n不小于0]具有两个或多个被取代基（4）取代的羟基（其中R 4 为1-15℃烃基）的取代率为10 小于100％。 提供其制造方法，由其组成的环氧树脂固化剂和包含固化剂的环氧树脂组合物。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009185176A

公开(公告)日：2009-08-20

申请号：JP2008026736

申请日：2008-02-06

Applicant: Air Water Inc ,  エア・ウォーター株式会社

Inventor： TAKAHASHI KO ,  SONE YOSHIHISA

IPC: C08G59/40 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide a silane mixture containing an aryloxysilane compound, and a curing agent for an epoxy resin comprising the mixture.
SOLUTION: The silane mixture comprises a protective type aryloxysilane compound where hydroxy groups of a phenol compound of formula (1) are substituted at least in part by a siloxy group of formula (4), and a silane compound of formula (5) in an amount of 0.1-50 wt% in the whole mixture. The curing agent for an epoxy resin comprises the silane mixture. The epoxy resin composition comprises the curing agent. An epoxy resin cured product is provided. In the formulae, Ar
1 and Ar
2 are each a phenylene group or a naphthalene group which may have substituents; R
4 to R
6 are each a hydrocarbon group; R
7 to R
10 are each a saturated aliphatic hydrocarbon group, or an aromatic hydrocarbon group which may have a saturated aliphatic substituent, optionally containing N, O, S or a halogen, on the benzene ring.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供含有芳氧基硅烷化合物的硅烷混合物和包含该混合物的环氧树脂固化剂。 解决方案：硅烷混合物包含保护型芳氧基硅烷化合物，其中式（1）的酚化合物的羟基至少部分地被式（4）的甲硅烷氧基取代，并且式（5）的硅烷化合物 ）在整个混合物中的量为0.1-50重量％。 用于环氧树脂的固化剂包括硅烷混合物。 环氧树脂组合物包含固化剂。 提供环氧树脂固化产物。 在式中，Ar 1 和Ar 2 分别是可以具有取代基的亚苯基或萘基; R 4 至R 6 分别为烃基; R 7 至R 10 分别为饱和脂族烃基或可具有饱和脂肪族取代基的芳香族烃基，任选含有N，O，S或卤素 ，在苯环上。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2007262129A

公开(公告)日：2007-10-11

申请号：JP2006085305

申请日：2006-03-27

Applicant: Air Water Inc ,  エア・ウォーター株式会社

Inventor： ONDA SHINJI ,  SONE YOSHIHISA

IPC: C08G59/62 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin composition suitable as a semiconductor sealing material, having low water absorption properties, excellent flame retardance, quick-curing properties and a low melt viscosity and a phenol-based polymer curing agent for forming the composition.
SOLUTION: A phenol-based polymer obtained by reacting phenol with a benzaldehyde and having a melt viscosity at 150°C of ≤1.5 poise, a softening point (JIS K2207) of ≥85°C and a hydroxyl equivalent of 135-150 g/eq is used as a curing agent. An epoxy resin is mixed with the curing agent, a curing promoter and an inorganic filler.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了获得适合作为半导体密封材料的环氧树脂组合物，具有低吸水性，优异的阻燃性，快速固化性能和低熔体粘度，以及用于形成的酚基聚合物固化剂 组成。 解决方案：通过苯酚与苯甲醛反应，在150℃下的熔融粘度≤1.5泊，软化点（JIS K2207）≥85℃，羟基当量为135〜 使用150g / eq作为固化剂。 将环氧树脂与固化剂，固化促进剂和无机填料混合。 版权所有（C）2008，JPO＆INPIT