Abstract:
PROBLEM TO BE SOLVED: To provide a polysiloxane compound having a phenolic hydroxyl group and a manufacturing method for it. SOLUTION: The polysiloxane compound containing a phenolic structure capable of preparing by hydrolyzing a mixture of a silane compound with a phenolic structure shown by a formula (1) and a non-functional group type silane shown by a formula (2) in a ratio between 100 to 0 and 1 to 99, wherein an area of T 3 signal in all of signals being ascribed to silicon species as T 0 , T 1 , T 2 and T 3 on 29 Si-NMR measurement accounts for 20 to 100%, and its manufacturing method, a curing agent for an epoxy resin made of the polysiloxane compound, an epoxy resin composition and a cured material of the epoxy resin are also disclosed. The polysiloxane compound can provide various organic-inoganic hybrid materials, through the curing together with an epoxy resin. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing a photosensitive resin giving a cured product excellent in heat resistance, toughness, flexibility, water resistance, chemical resistance, electrical insulating properties, etc., with a simple and easy way.SOLUTION: The method for producing a photosensitive resin (e) of formula (2) comprises: reacting a reaction product (c) of a phenol resin (a) and alkylene oxides and/or cyclic carbonates (b) with an unsaturated monocarboxylic acid (d) in the presence of an esterification catalyst; neutralizing the esterification catalyst used in the reaction with a hydroxide and/or carbonate of an alkaline earth metal; and removing the generated salt by filtration.
Abstract:
PROBLEM TO BE SOLVED: To provide: a curing agent having an higher curing capability than a conventional curing agent for an epoxy resin, and capable of yielding a resin of a higher glass transition temperature than that of a resin produced by the conventional curing agent; a dihydroxynaphthalene polymer suitable as a curing agent; an epoxy resin composition comprising the curing agent; and a cured material resulting from the composition. SOLUTION: There are provided a dihydroxynaphthalene polymer represented by formula (1) (wherein n is 1 to 10; and m and m' are each 0 to 4 provided that m+m' is equal to or greater than 1), a curing agent comprising the same for curing an epoxy resin, an epoxy resin composition comprising the curing agent, and a cured material resulting from the composition. There is also provided a method of producing the polymer represented by formula (1) by subjecting a dihydroxynaphthalene represented by formula (2), a biphenyl compound represented by formula (3) and an aromatic compound represented by formula (4) to a condensation reaction. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a new phenol-derived trialkoxysilane compound with a phenolic hydroxy group protected by a protective group easy to undergo depotection, deemed to be useful as a raw material for organic-inorganic hybrid materials and a silane coupling agent, and to provide a method for efficiently producing the above compound. SOLUTION: The new phenol-derived silane compound is represented by formula (1). The method for producing this silane compound comprises conducting a reaction of a hydrosilane compound of formula (2) with a phenol-derived olefin compound of formula (3). COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a modifier which can be compounded with an epoxy resin composition comprising an epoxy resin and a hardening agent to improve flame retardancy and adhesiveness and lower elastic modulus, when heated, to provide its production method, and to provide an epoxy resin composition compounded with the same. SOLUTION: This modifier for epoxy resins comprises an aromatic hydrocarbon resin having a softening point of 50 to 150°C and obtained by condensing a bifunctional aromatic compound such as p-xylylene glycol or 4,4'-bischloromethylbiphenyl with an aromatic hydrocarbon such as naphthalene in the presence of an acid catalyst, and an epoxy resin composition containing the same. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a phenol derivative-type compound which acts as an epoxy resin curing agent having a rapid curing property and can give an epoxy resin cured product having a high glass transition temperature, and which ensures a small viscosity rise and can maintain high fluidity of the composition when added to an epoxy resin composition. SOLUTION: The phenol derivative-type compound is obtained by substituting, in the case of three or more hydroxy groups in a phenolic compound of formula (1), 20-100% of the hydroxy groups by substituents of formula (4) or (5) and by substituting, in the case of two hydroxy groups, 20 to
Abstract:
PROBLEM TO BE SOLVED: To provide a polysiloxane compound easily convertible into a polysiloxane compound having a liberated phenolic hydroxy group, and a method of producing the same. SOLUTION: The polysiloxane compound is a reaction product obtained by hydrolyzing a silane compound represented by formula (1) with water in an amount of 0.75-10 equivalent per equivalent of alkoxy group present in the silane compound. In the polysiloxane compound, the area of T 3 in all signals assigned to silicon species T 0 , T 1 , T 2 and T 3 measured by 29 Si-NMR is 20-100%. The method of producing the polysiloxane compound includes hydrolysis of the compound represented by formula (1). In formula (1), m is an integer of 1-5; n is an integer of 0-10; k is 1 or 2; R 1 -R 3 and R 9 are each a 1-10C saturated aliphatic hydrocarbon substituent or an aromatic hydrocarbon group in which zero to five 1-10C saturated aliphatic substituents are bonded to a benzene ring; and R 4 -R 8 are each a hydrogen atom, a 1-10C saturated aliphatic hydrocarbon substituent, or an aromatic hydrocarbon group in which zero to five 1-10C saturated aliphatic substituents are bonded to the benzene ring. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a curing agent excellent in flame retardancy, curability, and having a high glass transition temperature (Tg), a method of producing the same, and a use thereof. SOLUTION: There are provided a phenolic polymer represented by formula (1) [wherein R 1 represents H, an alkyl group or an aryl group; n+m is 2 to 6; and R 2 represents a group represented by formula (α)], and a method of producing the phenolic polymer including a process of subjecting a phenol represented by formula (2), a biphenyl compound represented by formula (3), and an aromatic aldehyde represented by formula (4): R 2 -CHO to a condensation reaction and a subsequent process of removing the unreacted phenol. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation:要解决的问题:提供阻燃性,固化性和玻璃化转变温度(Tg)高的固化剂,其制造方法及其用途。 提供由式(1)表示的酚类聚合物[其中R 1表示H,烷基或芳基; n + m为2〜6; R 2表示由式(α)表示的基团),以及生产酚类聚合物的方法,包括使由式(2)表示的苯酚,式(2)表示的联苯化合物 3),和由式(4)表示的芳族醛:R 2 SP 2 -CH 2与缩合反应和随后的除去未反应的苯酚的方法。 版权所有(C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a phenolic polymer suitable for sealing a semiconductor having low melting viscosity and flame retardancy, to provide its composition and to provide its production method. SOLUTION: Phenols represented by formula (1), an aromatic compound represented by formula (2) (R 1 denotes hydrogen, a 1-6C alkyl or an aryl and X demotes a halogen, OH or OCH 3 ), a m-xylene-formaldehyde condensate and formaldehyde are reacted at a molar ratio of the aromatic compound to the phenols of 0.1 to 0.6, at a rate by weight of the condensate to the phenols of 5 to 25% and at a molar ratio of formaldehyde to the phenols of 0.01 to 0.20 to obtain the phenolic polymer. In the easy and inexpensive production method of the phenolic polymer, the phenols, the aromatic compound and the condensate are reacted and then formaldehyde is added to condense them. As the composition, an epoxy resin composition with an epoxy resin is suitable. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a phenol aralkyl resin composition and a method for producing it which causes no blocking despite its low viscosity and can be easily handled and suitably used for sealing a semiconductor. SOLUTION: The phenol aralkyl resin composition contains a phenol aralkyl resin, which has a softening point of 50-70°C and shows melt viscosity of 20-120 mPas at 150°C, and inorganic filler, and a content of the inorganic filler in the composition is 10-80 wt.%. In the method for producing the above composition, the inorganic filler is mixed with the phenol aralkyl resin, which is prepared by reacting 0.1-0.8 mole of an aromatic bis-halogenomethyl compound, an aromatic bis-hydroxymethyl compound, or an aromatic bis-alkoxymethyl compound with 1 mole of a phenol compound. COPYRIGHT: (C)2009,JPO&INPIT