Polysiloxane compound, manufacturing method of the same and use of the same
    1.
    发明专利
    Polysiloxane compound, manufacturing method of the same and use of the same 审中-公开
    聚硅氧烷化合物,其制造方法及其用途

    公开(公告)号:JP2008266576A

    公开(公告)日:2008-11-06

    申请号:JP2008025681

    申请日:2008-02-05

    Abstract: PROBLEM TO BE SOLVED: To provide a polysiloxane compound having a phenolic hydroxyl group and a manufacturing method for it.
    SOLUTION: The polysiloxane compound containing a phenolic structure capable of preparing by hydrolyzing a mixture of a silane compound with a phenolic structure shown by a formula (1) and a non-functional group type silane shown by a formula (2) in a ratio between 100 to 0 and 1 to 99, wherein an area of T
    3 signal in all of signals being ascribed to silicon species as T
    0 , T
    1 , T
    2 and T
    3 on
    29 Si-NMR measurement accounts for 20 to 100%, and its manufacturing method, a curing agent for an epoxy resin made of the polysiloxane compound, an epoxy resin composition and a cured material of the epoxy resin are also disclosed. The polysiloxane compound can provide various organic-inoganic hybrid materials, through the curing together with an epoxy resin.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 解决的问题:提供具有酚羟基的聚硅氧烷化合物及其制造方法。 解决方案:含有能够通过将式(1)所示的硅烷化合物与酚类结构的混合物和式(2)所示的非官能团型硅烷的混合物水解制备的酚醛结构的聚硅氧烷化合物在 100至0和1至99之间的比率,其中所有信号中的T 3 信号的面积归因于硅种类,T 1 在 29 Si-NMR测量中,,T 2 和T 3 占20至100%,其制造方法 还公开了由聚硅氧烷化合物制成的环氧树脂的固化剂,环氧树脂组合物和环氧树脂的固化物。 聚硅氧烷化合物可以通过与环氧树脂一起固化来提供各种有机 - 无机混合材料。 版权所有(C)2009,JPO&INPIT

    Method for producing photosensitive resin
    2.
    发明专利
    Method for producing photosensitive resin 审中-公开
    生产感光树脂的方法

    公开(公告)号:JP2012062362A

    公开(公告)日:2012-03-29

    申请号:JP2010205837

    申请日:2010-09-14

    Abstract: PROBLEM TO BE SOLVED: To provide a method for producing a photosensitive resin giving a cured product excellent in heat resistance, toughness, flexibility, water resistance, chemical resistance, electrical insulating properties, etc., with a simple and easy way.SOLUTION: The method for producing a photosensitive resin (e) of formula (2) comprises: reacting a reaction product (c) of a phenol resin (a) and alkylene oxides and/or cyclic carbonates (b) with an unsaturated monocarboxylic acid (d) in the presence of an esterification catalyst; neutralizing the esterification catalyst used in the reaction with a hydroxide and/or carbonate of an alkaline earth metal; and removing the generated salt by filtration.

    Abstract translation: 要解决的问题:提供一种制备感光性树脂的方法,其以简单和容易的方式给出耐热性,韧性,柔韧性,耐水性,耐化学性,电绝缘性等优异的固化产物。 解决方案:制备式(2)的感光性树脂(e)的方法包括:使酚醛树脂(a)的反应产物(c)与环氧烷和/或环状碳酸酯(b)与不饱和的 一元羧酸(d)在酯化催化剂存在下进行; 中和与碱土金属的氢氧化物和/或碳酸盐反应的酯化催化剂; 并通过过滤除去生成的盐。 版权所有(C)2012,JPO&INPIT

    Dihydroxynaphthalene polymer, method of producing the same, and use therefor
    3.
    发明专利
    Dihydroxynaphthalene polymer, method of producing the same, and use therefor 有权
    二羟基苯乙烯聚合物,其生产方法及其用途

    公开(公告)号:JP2010260802A

    公开(公告)日:2010-11-18

    申请号:JP2009111629

    申请日:2009-04-30

    Abstract: PROBLEM TO BE SOLVED: To provide: a curing agent having an higher curing capability than a conventional curing agent for an epoxy resin, and capable of yielding a resin of a higher glass transition temperature than that of a resin produced by the conventional curing agent; a dihydroxynaphthalene polymer suitable as a curing agent; an epoxy resin composition comprising the curing agent; and a cured material resulting from the composition.
    SOLUTION: There are provided a dihydroxynaphthalene polymer represented by formula (1) (wherein n is 1 to 10; and m and m' are each 0 to 4 provided that m+m' is equal to or greater than 1), a curing agent comprising the same for curing an epoxy resin, an epoxy resin composition comprising the curing agent, and a cured material resulting from the composition. There is also provided a method of producing the polymer represented by formula (1) by subjecting a dihydroxynaphthalene represented by formula (2), a biphenyl compound represented by formula (3) and an aromatic compound represented by formula (4) to a condensation reaction.
    COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 待解决的问题:提供:具有比常规的环氧树脂固化剂更高的固化能力的固化剂,并且能够产生比常规的树脂生产的树脂高的玻璃化转变温度的树脂 固化剂; 适合作为固化剂的二羟基萘聚合物; 包含该固化剂的环氧树脂组合物; 和由该组合物得到的固化物。 解决方案:提供由式(1)表示的二羟基萘聚合物(其中n为1至10;并且m和m'各自为0至4,条件是m + m'等于或大于1) 包含其固化环氧树脂的固化剂,包含固化剂的环氧树脂组合物和由该组合物得到的固化物。 还提供了通过使由式(2)表示的二羟基萘,由式(3)表示的联苯化合物和由式(4)表示的芳族化合物进行缩合反应而制备由式(1)表示的聚合物的方法 。 版权所有(C)2011,JPO&INPIT

    Phenol-derived silane compound, and method for producing the same
    4.
    发明专利
    Phenol-derived silane compound, and method for producing the same 审中-公开
    苯酚衍生的硅烷化合物及其生产方法

    公开(公告)号:JP2008231038A

    公开(公告)日:2008-10-02

    申请号:JP2007073953

    申请日:2007-03-22

    CPC classification number: Y02P20/55

    Abstract: PROBLEM TO BE SOLVED: To provide a new phenol-derived trialkoxysilane compound with a phenolic hydroxy group protected by a protective group easy to undergo depotection, deemed to be useful as a raw material for organic-inorganic hybrid materials and a silane coupling agent, and to provide a method for efficiently producing the above compound. SOLUTION: The new phenol-derived silane compound is represented by formula (1). The method for producing this silane compound comprises conducting a reaction of a hydrosilane compound of formula (2) with a phenol-derived olefin compound of formula (3). COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 待解决的问题:为了提供一种酚类羟基的苯酚衍生的三烷氧基硅烷化合物,该酚羟基被易于进行脱保护的保护基保护,被认为可用作有机 - 无机杂化材料的原料和硅烷偶联 并提供有效生产上述化合物的方法。 解决方案:新的酚衍生的硅烷化合物由式(1)表示。 制备该硅烷化合物的方法包括使式(2)的氢化硅烷化合物与式(3)的酚衍生的烯烃化合物进行反应。 版权所有(C)2009,JPO&INPIT

    Aromatic hydrocarbon resin, its production method and its use
    5.
    发明专利
    Aromatic hydrocarbon resin, its production method and its use 有权
    芳香烃树脂,其生产方法及其用途

    公开(公告)号:JP2006282715A

    公开(公告)日:2006-10-19

    申请号:JP2005101305

    申请日:2005-03-31

    Abstract: PROBLEM TO BE SOLVED: To provide a modifier which can be compounded with an epoxy resin composition comprising an epoxy resin and a hardening agent to improve flame retardancy and adhesiveness and lower elastic modulus, when heated, to provide its production method, and to provide an epoxy resin composition compounded with the same.
    SOLUTION: This modifier for epoxy resins comprises an aromatic hydrocarbon resin having a softening point of 50 to 150°C and obtained by condensing a bifunctional aromatic compound such as p-xylylene glycol or 4,4'-bischloromethylbiphenyl with an aromatic hydrocarbon such as naphthalene in the presence of an acid catalyst, and an epoxy resin composition containing the same.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种改性剂,其可以与包含环氧树脂和硬化剂的环氧树脂组合物配混以改善阻燃性和粘合性,并且在加热时具有较低的弹性模量,以提供其制备方法,以及 以提供与其配混的环氧树脂组合物。 解决方案:该环氧树脂改性剂包括软化点为50-150℃的芳族烃树脂,通过将双官能芳族化合物如对二甲苯基二醇或4,4'-二氯甲基联苯与芳族烃缩合得到 如酸催化剂存在下的萘,以及含有该催化剂的环氧树脂组合物。 版权所有(C)2007,JPO&INPIT

    Phenol derivative-type curing agent, method for producing the same and use thereof
    6.
    发明专利
    Phenol derivative-type curing agent, method for producing the same and use thereof 审中-公开
    PHENOL衍生型固化剂,其制备方法和用途

    公开(公告)号:JP2010159317A

    公开(公告)日:2010-07-22

    申请号:JP2009000744

    申请日:2009-01-06

    Abstract: PROBLEM TO BE SOLVED: To provide a phenol derivative-type compound which acts as an epoxy resin curing agent having a rapid curing property and can give an epoxy resin cured product having a high glass transition temperature, and which ensures a small viscosity rise and can maintain high fluidity of the composition when added to an epoxy resin composition.
    SOLUTION: The phenol derivative-type compound is obtained by substituting, in the case of three or more hydroxy groups in a phenolic compound of formula (1), 20-100% of the hydroxy groups by substituents of formula (4) or (5) and by substituting, in the case of two hydroxy groups, 20 to

    Abstract translation: 要解决的问题:提供一种具有快速固化性能的环氧树脂固化剂的苯酚衍生物型化合物,并且可以得到具有高玻璃化转变温度的环氧树脂固化产物,并确保粘度小 并且当添加到环氧树脂组合物中时可以保持组合物的高流动性。 解决方案:酚衍生物型化合物通过在式(1)的酚类化合物中用三个或多个羟基代替通式(4)的取代基的20-100%的羟基来获得, 或(5),并且在两个羟基的情况下,通过这样的取代基代替20〜80%的羟基,酚衍生物型化合物的羟基当量为30-200g / eq。 在120℃下熔融粘度≤3,000mPa s。 在式(1)中,Ar为亚苯基或萘基,R为烷基。 版权所有(C)2010,JPO&INPIT

    Polysiloxane compound and method of producing the same
    7.
    发明专利
    Polysiloxane compound and method of producing the same 审中-公开
    聚硅氧烷化合物及其制造方法

    公开(公告)号:JP2010095689A

    公开(公告)日:2010-04-30

    申请号:JP2008270332

    申请日:2008-10-20

    Abstract: PROBLEM TO BE SOLVED: To provide a polysiloxane compound easily convertible into a polysiloxane compound having a liberated phenolic hydroxy group, and a method of producing the same.
    SOLUTION: The polysiloxane compound is a reaction product obtained by hydrolyzing a silane compound represented by formula (1) with water in an amount of 0.75-10 equivalent per equivalent of alkoxy group present in the silane compound. In the polysiloxane compound, the area of T
    3 in all signals assigned to silicon species T
    0 , T
    1 , T
    2 and T
    3 measured by
    29 Si-NMR is 20-100%. The method of producing the polysiloxane compound includes hydrolysis of the compound represented by formula (1). In formula (1), m is an integer of 1-5; n is an integer of 0-10; k is 1 or 2; R
    1 -R
    3 and R
    9 are each a 1-10C saturated aliphatic hydrocarbon substituent or an aromatic hydrocarbon group in which zero to five 1-10C saturated aliphatic substituents are bonded to a benzene ring; and R
    4 -R
    8 are each a hydrogen atom, a 1-10C saturated aliphatic hydrocarbon substituent, or an aromatic hydrocarbon group in which zero to five 1-10C saturated aliphatic substituents are bonded to the benzene ring.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 解决的问题:提供容易转化成具有游离酚性羟基的聚硅氧烷化合物的聚硅氧烷化合物及其制造方法。 解决方案:聚硅氧烷化合物是通过水解由式(1)表示的硅烷化合物得到的水,其量为存在于硅烷化合物中的每当量烷氧基的0.75-10当量的反应产物。 在聚硅氧烷化合物中,分配给硅物质T 0 ,T 1 ,T 2的所有信号中的T 3 / SP>和T 3 通过Si-NMR测量为20-100%。 聚硅氧烷化合物的制造方法包括水解式(1)表示的化合物。 在式(1)中,m为1-5的整数; n是0-10的整数; k为1或2; R 1 -R 3 和R 9 分别是1-10C饱和脂族烃取代基或芳族烃基,其中0-5 -10℃的饱和脂肪族取代基与苯环键合; R 4和R 4各自为氢原子,1-10C饱和脂族烃取代基或芳族烃基,其中0-5个1-10个饱和脂肪族 取代基与苯环键合。 版权所有(C)2010,JPO&INPIT

    Phenolic polymer, method of producing the same, and use therefor
    8.
    发明专利
    Phenolic polymer, method of producing the same, and use therefor 审中-公开
    酚醛聚合物,其制备方法及其用途

    公开(公告)号:JP2010070471A

    公开(公告)日:2010-04-02

    申请号:JP2008237410

    申请日:2008-09-17

    Abstract: PROBLEM TO BE SOLVED: To provide a curing agent excellent in flame retardancy, curability, and having a high glass transition temperature (Tg), a method of producing the same, and a use thereof.
    SOLUTION: There are provided a phenolic polymer represented by formula (1) [wherein R
    1 represents H, an alkyl group or an aryl group; n+m is 2 to 6; and R
    2 represents a group represented by formula (α)], and a method of producing the phenolic polymer including a process of subjecting a phenol represented by formula (2), a biphenyl compound represented by formula (3), and an aromatic aldehyde represented by formula (4): R
    2 -CHO to a condensation reaction and a subsequent process of removing the unreacted phenol.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:提供阻燃性,固化性和玻璃化转变温度(Tg)高的固化剂,其制造方法及其用途。 提供由式(1)表示的酚类聚合物[其中R 1表示H,烷基或芳基; n + m为2〜6; R 2表示由式(α)表示的基团),以及生产酚类聚合物的方法,包括使由式(2)表示的苯酚,式(2)表示的联苯化合物 3),和由式(4)表示的芳族醛:R 2 SP 2 -CH 2与缩合反应和随后的除去未反应的苯酚的方法。 版权所有(C)2010,JPO&INPIT

    Phenolic polymer, its production method, and its application
    9.
    发明专利
    Phenolic polymer, its production method, and its application 有权
    酚醛聚合物及其制备方法及其应用

    公开(公告)号:JP2009242480A

    公开(公告)日:2009-10-22

    申请号:JP2008088279

    申请日:2008-03-28

    Abstract: PROBLEM TO BE SOLVED: To provide a phenolic polymer suitable for sealing a semiconductor having low melting viscosity and flame retardancy, to provide its composition and to provide its production method.
    SOLUTION: Phenols represented by formula (1), an aromatic compound represented by formula (2) (R
    1 denotes hydrogen, a 1-6C alkyl or an aryl and X demotes a halogen, OH or OCH
    3 ), a m-xylene-formaldehyde condensate and formaldehyde are reacted at a molar ratio of the aromatic compound to the phenols of 0.1 to 0.6, at a rate by weight of the condensate to the phenols of 5 to 25% and at a molar ratio of formaldehyde to the phenols of 0.01 to 0.20 to obtain the phenolic polymer. In the easy and inexpensive production method of the phenolic polymer, the phenols, the aromatic compound and the condensate are reacted and then formaldehyde is added to condense them. As the composition, an epoxy resin composition with an epoxy resin is suitable.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:提供适合于密封具有低熔点粘度和阻燃性的半导体的酚醛聚合物,以提供其组成并提供其制备方法。 解决方案:由式(1)表示的酚,由式(2)表示的芳族化合物(R 1 SP 1表示氢,1-6C烷基或芳基,X表示卤素,OH 或OCH 3 SB 3),间 - 二甲苯 - 甲醛缩合物和甲醛以芳族化合物与酚的摩尔比为0.1至0.6,以缩合物与酚的重量比 为5〜25%,甲醛与酚的摩尔比为0.01〜0.20,得到酚类聚合物。 在酚类聚合物的容易且廉价的生产方法中,酚,芳族化合物和缩合物反应,然后加入甲醛以冷凝它们。 作为组合物,具有环氧树脂的环氧树脂组合物是合适的。 版权所有(C)2010,JPO&INPIT

    Phenolic resin composition and method for producing it
    10.
    发明专利
    Phenolic resin composition and method for producing it 审中-公开
    酚醛树脂组合物及其生产方法

    公开(公告)号:JP2009096891A

    公开(公告)日:2009-05-07

    申请号:JP2007270333

    申请日:2007-10-17

    Abstract: PROBLEM TO BE SOLVED: To provide a phenol aralkyl resin composition and a method for producing it which causes no blocking despite its low viscosity and can be easily handled and suitably used for sealing a semiconductor.
    SOLUTION: The phenol aralkyl resin composition contains a phenol aralkyl resin, which has a softening point of 50-70°C and shows melt viscosity of 20-120 mPas at 150°C, and inorganic filler, and a content of the inorganic filler in the composition is 10-80 wt.%. In the method for producing the above composition, the inorganic filler is mixed with the phenol aralkyl resin, which is prepared by reacting 0.1-0.8 mole of an aromatic bis-halogenomethyl compound, an aromatic bis-hydroxymethyl compound, or an aromatic bis-alkoxymethyl compound with 1 mole of a phenol compound.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 待解决的问题:提供一种苯酚芳烷基树脂组合物及其生产方法,尽管其粘度低,不会发生阻塞,并且可以容易地处理并适合用于密封半导体。 酚芳烷基树脂组合物含有酚芳烷基树脂,其软化点为50-70℃,在150℃下的熔体粘度为20-120mPa·s,无机填料含量为 组合物中的无机填料为10-80重量%。 在制备上述组合物的方法中,将无机填料与苯酚芳烷基树脂混合,该酚芳烷基树脂通过使0.1-0.8摩尔芳族双 - 卤代甲基化合物,芳族双 - 羟甲基化合物或芳族双 - 烷氧基甲基 与1摩尔酚化合物混合。 版权所有(C)2009,JPO&INPIT

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