Resin composition for extrusion molding and extrusion-molded article
    53.
    发明专利
    Resin composition for extrusion molding and extrusion-molded article 有权
    挤出成型和挤出成型品的树脂组合物

    公开(公告)号:JP2006152227A

    公开(公告)日:2006-06-15

    申请号:JP2005006457

    申请日:2005-01-13

    摘要: PROBLEM TO BE SOLVED: To provide a hollow molded product by blow molding or extrusion in a simple manner without sacrificing low gas permeability characteristic of a liquid crystalline polymer, while imparting drawdown resistance and even thickness of the molded product. SOLUTION: This resin composition for extrusion molding, which has melt viscosity of 60 to 4,000 Pa×s measured at a shear rate of 1,000/sec at the following temperature T1 and melt tension of not less than 20 mN at a take-off speed of 14.8 m/min. This resin composition is produced by melt kneading 99 to 70% by weight of a wholly aromatic polyesteramide liquid crystalline resin (A) comprising 1 to 15% by mole of 6-hydroxy-2-naphthoic acid residue, 40 to 70% by mole of a 4-hydyroxybenzolic acid residue, 5 to 28.5% by mole of an aromatic diol residue, 1 to 20% by mole of 4-aminophenol residue, and 6 to 29.5% by mole of an aromatic dicarboxylic acid residue and having a melting point of 270 to 370°C and melt viscosity of 20 to 60 Pa×s at a shear rate of 1,000/sec at a temperature T1 which is by 20°C above the melting point, with 1 to 30% by weight of an epoxy-modified polyolefin resin (B). COPYRIGHT: (C)2006,JPO&NCIPI

    摘要翻译: 要解决的问题:通过吹塑或挤出以简单的方式提供中空成型产品,而不会牺牲液晶聚合物的低透气性,同时赋予模压产品的抗压降性和均匀的厚度。 解决方案:这种挤出成型用树脂组合物,其在以下温度T1下以1000 /秒的剪切速度测量的熔体粘度为60〜4,000Pa·s,在取出温度下的熔融张力为20mN以上, 关闭速度为14.8米/分钟。 该树脂组合物通过将99〜70重量%的全芳香族聚酯酰胺液晶性树脂(A)熔融捏合而制造,所述全芳香族聚酯酰胺液晶性树脂(A)含有1〜15摩尔%的6-羟基-2-萘甲酸残基,40〜70摩尔% 4-羟基苯甲酸残基,5〜28.5摩尔%芳族二醇残基,1〜20摩尔%的4-氨基苯酚残基和6〜29.5摩尔%的芳香族二羧酸残基,熔点为 270〜370℃,熔融粘度为20〜60Pa×s,剪切速度为1000 /秒,熔点20℃以上的温度T1为1〜30重量%,环氧改性 聚烯烃树脂(B)。 版权所有(C)2006,JPO&NCIPI

    Transparent composition comprising polyamide as base
    57.
    发明专利
    Transparent composition comprising polyamide as base 审中-公开
    以POLYAMIDE AS为基础的透明组合物

    公开(公告)号:JP2005163053A

    公开(公告)日:2005-06-23

    申请号:JP2005023468

    申请日:2005-01-31

    申请人: Arkema アルケマ

    摘要: PROBLEM TO BE SOLVED: To provide a transparent composition comprising a polyamide as a base, an article composed of the composition especially a film to be bonded to a ski plate, and an article covered with a transparent protective layer composed of the composition and decorated with a sublimable ink. SOLUTION: The transparent composition comprises following (1) to (3) (100 wt.% in total): (1) 5-40 wt.% amorphous polyamide (B) obtained by condensing at least one kind of optionally alicyclic diamine, at least one kind of aromatic diacid and, as an optional ingredient, at least one kind of monomer chosen from α, ω-aminocarboxylic acids, aliphatic diacids and aliphatic diamines, (2) 0-40 wt.% supple polyamide (C) chosen from copolymers containing polyamide blocks and polyether blocks and copolyamides, and (3) 0-20 wt.% compatibilizer (D) for (A) and (B) [wherein, (C)+(D)=2-50 wt.%; (B)+(C)+(D) is not less than 30 wt.%; and the difference to 100 wt.% is a semicrystalline polyamide (A)]. COPYRIGHT: (C)2005,JPO&NCIPI

    摘要翻译: 要解决的问题:为了提供一种透明组合物,其包含聚酰胺作为基底,由组合物特别是要与滑板接合的膜组成的制品和被该组合物组成的透明保护层 并用可升华的墨水装饰。 解决方案:透明组合物包括以下(1)至(3)(总计100重量%):(1)5-40重量%的无定形聚酰胺(B),其通过将至少一种任选的脂环族 二胺,至少一种芳族二酸和作为任选成分的至少一种选自α,ω-氨基羧酸,脂族二酸和脂族二胺的单体,(2)0-40重量%的柔软聚酰胺(C )选自包含聚酰胺嵌段和聚醚嵌段和共聚酰胺的共聚物,和(3)用于(A)和(B)的0-20重量%增容剂(D)[其中,(C)+(D)= 2-50重量% %; (B)+(C)+(D)不小于30重量%; 并且与100重量%的差异是半结晶聚酰胺(A)]。 版权所有(C)2005,JPO&NCIPI