Abstract:
PROBLEM TO BE SOLVED: To obtain a conductive particle which shows high conductivity and has a conductive layer having adhesion and flexibility capable of following deformation when compressively deformed, and is excellent in reliability.SOLUTION: A conductive particle includes a base resin particle, a plurality of nano-size conductive particles, and a conductive layer. The conductive particle is provided with a conductive network formed by point connection between the plurality of nano-size conductive particles adhering to the surface of the base resin particle, and the conductive layer formed on the nano-size conductive particles by plating. The base resin particle is coated with a surface modifier before adhesion of the nano-size conductive particles, and the nano-size conductive particles adhere to the surface of the base resin particle by a dry method. The conductive particle is suitably used for a conductive spacer or a conductive material such as an anisotropic conductive material.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of producing a silica zeolite insulation film ensuring a low relative permittivity and a high mechanical strength, even if calcination is performed under an inert gas atmosphere.SOLUTION: The method of producing a silica zeolite insulation film includes a calcination step for coating a base material with a coating liquid containing a silica zeolite crystal obtained by hydrothermal synthesis and a surfactant, and then performing calcination under an inert gas atmosphere, a hydrophobic treatment step, and an ultraviolet treatment step. A silica zeolite insulation film is produced by performing the ultraviolet treatment step and a second hydrophobic treatment step, a plurality of time, in this order following to the calcination step, and the first hydrophobic treatment step.
Abstract:
PROBLEM TO BE SOLVED: To provide a precursor composition of a low dielectric constant film used for manufacturing a low dielectric constant film that is suppressed in degradation of hydrophobic properties even through being irradiated with UV and is suppressed in increase of a dielectric constant, and a method for manufacturing the low dielectric constant film.SOLUTION: A precursor composition of a low dielectric constant film comprises at least one compound selected from the groups consisting of diethoxymethylsilane, dimethoxymethylsilane, diethoxydisilane, dimethoxydisilane, triethoxysilane, trimethoxysilane, dimethylethoxysilane and dimethylmethoxysilane; at least one substance selected from the groups consisting of compounds represented by Formula: (RO)-Si-X-Si-(RO)(wherein RO is alkoxy and X is an organic crosslinking group selected from the groups consisting of methylene, ethylene, vinylene and 1,4-phenylene), compounds represented by Formula: Si(OR)(wherein R is a univalent organic group), cyclic siloxanes, double cyclic siloxanes and zeolite crystallite; a pyrolytic compound; and an alkoxysilane hydrolytic catalyst.