公开(公告)号：JP2012146952A

公开(公告)日：2012-08-02

申请号：JP2011228179

申请日：2011-10-17

Applicant: Fitilite (S) Pte Ltd Taiwan Branch ,  フィティライト(エス) ピーティーイー. リミテッド タイワン ブランチ

Inventor： PURU LIN

IPC: H01L33/00 ,  H01L23/36

CPC classification number: H05K1/053 ,  F21K9/23 ,  F21K9/90 ,  F21V29/70 ,  F21V29/86 ,  F21Y2115/10 ,  H01L2224/48091 ,  H05K1/0203 ,  H05K3/06 ,  H05K3/1216 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To provide a light-emitting device exhibiting excellent heat dissipation and anti-high voltage characteristics which allows for cost reduction by reducing the number of mounting processes, and to provide a formation method thereof.SOLUTION: The light-emitting device comprises a base 200 including a first surface 200a, a conductive line layer 300 formed on the first surface, and a light-emitting diode module 400 including a substrate 410 and at least one light-emitting diode 450 placed on the substrate. The substrate of the light-emitting diode module is placed on the conductive line layer by surface mounting method. The base is composed of one material selected from a group of aluminum subjected to surface oxidation, aluminum having an oxide layer on the surface, aluminum oxide and aluminum nitride.

Abstract translation: 要解决的问题：提供一种具有优异的散热和抗高压特性的发光装置，其通过减少安装工艺的数量来降低成本，并提供其形成方法。 解决方案：发光器件包括基底200，基底200包括第一表面200a，形成在第一表面上的导电线层300和发光二极管模块400，发光二极管模块400包括基底410和至少一个发光 二极管450放置在基板上。 通过表面贴装法将发光二极管模块的基板配置在导线层上。 基体由选自表面氧化的铝的一种材料，表面具有氧化物层的铝，氧化铝和氮化铝构成。 版权所有（C）2012，JPO＆INPIT