Patent search ap:("アプライドマテリアルズスイツァーランドエスエー") AND inv:"フィリップナッシュ" Page 1

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发明专利
Wire cutting device for mounting plate, wire cutting equipment, including wire cutting device for mounting plate, and wire cutting process to be executed by the wire cutting device 审中-公开

公开(公告)号：JP2011518688A

公开(公告)日：2011-06-30

申请号：JP2011505606

申请日：2009-02-23

Applicant: アプライドマテリアルズスイツァーランドエスエー

Inventor： フィリップナッシュ , ダビッドバラネス , ニクラウスヨハンビュセール

IPC: B28D7/04 , B24B27/06 , B28D5/04

CPC classification number: B28D5/0082 , B28D5/045 , Y10T83/95 , Y10T156/10

Abstract: The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide rail of said support table (20), said fastening means (15, 26, 40) consisting of a mounting plate (15) apt to be manufactured to which said piece (10) to be sawed is bonded, and of anchoring means (26, 40) for anchoring said mounting plate (15) directly on said carriage (18).

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