公开(公告)号：JP4386137B2

公开(公告)日：2009-12-16

申请号：JP2008051359

申请日：2008-02-29

Applicant: トヨタ自動車株式会社

Inventor： 裕彦 久野 ,  彰生 佐藤 ,  知弥 奥野 ,  友紀 小宮

IPC: B23K26/04 ,  B23K26/06 ,  B23K26/08 ,  G02B26/10

CPC classification number: G02B26/101 ,  B23K26/064 ,  B23K26/082 ,  B23K26/389

Abstract: A laser processing apparatus 11 comprises a first shift mechanism 31 including a first transparent member 41 having a first incident face 43 and a first output face 44 that are parallel to each other; and a first motor 42 that rotates the first transparent member 41 around a first rotational axis; wherein the first shift mechanism 31 shifts the laser beam L exiting from the first output face 44 in a state parallel with the incident light on the first incident face 43 in a first direction. The laser processing apparatus 11 also comprises a second shift mechanism 32 including a second transparent member 46 including a second incident face 48 and a second output face 49 that are parallel to each other; and a second motor 47 that rotates the second transparent member 46 around the second rotational axis; wherein the second rotating mechanism 32 rotates the laser beam L exiting from the second output face 49 in a state parallel with the laser beam L incident on the second incident face 48 in a second direction perpendicular to the first direction. A light collecting lens 22 collects the laser beam L shifted with the second shift section 32 to process a work W1. This configuration allows control of a taper angle of a hole formed by laser processing.