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公开(公告)号:JP5420530B2
公开(公告)日:2014-02-19
申请号:JP2010288502
申请日:2010-12-24
Applicant: 株式会社豊田中央研究所 , トヨタ自動車株式会社
CPC classification number: C01B31/02 , B82Y30/00 , C01B32/05 , H01M8/021 , H01M8/0228 , H01M8/0234 , Y02P70/56
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公开(公告)号:JPWO2015141641A1
公开(公告)日:2017-04-13
申请号:JP2016508723
申请日:2015-03-16
Applicant: トヨタ自動車株式会社
CPC classification number: C23C16/50 , C23C16/455 , H01J37/32541 , H01J37/32577 , H01J37/32724 , H01J37/32908 , H01J2237/3321 , H05H1/46 , H05H2245/123
Abstract: 高電圧を使用した場合においても異常放電を抑制することができるプラズマCVD装置を提供する。プラズマCVD装置100は、プラズマ空間を形成するチャンバー61と、チャンバー61の壁61aを貫通する端子導入孔62に配置される電力導入端子10と、を備え、電力導入端子10は、貫通孔22を有する碍子21と、貫通孔22に挿通される棒状導電体11と、を有し、棒状導電体11の一端はチャンバー61内に配置され、棒状導電体11の他端はチャンバー61内に電力を供給する電源Eと電気的に接続され、碍子21の内壁面211と棒状導電体11との隙間は2mm未満であり、碍子21におけるチャンバー61内のプラズマ空間に配置される一端から、碍子21と棒状導電体11との接点221までの距離は10mmより大きいことを特徴とする。
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公开(公告)号:JP4235789B2
公开(公告)日:2009-03-11
申请号:JP2002140297
申请日:2002-05-15
Applicant: トヨタ自動車株式会社
CPC classification number: F02M65/001 , B23K26/03 , B23K26/389 , F02M61/168 , F02M2200/8069
Abstract: PROBLEM TO BE SOLVED: To provide a minimal hole working method and device that enable required fluid injection quantity to be secured and that facilitate maximum improvement of productivity. SOLUTION: The device 1 for working a minimal hole is structured in the manner that, simultaneously with the piercing of the minimal hole 3, the flow rate of a fluid flowing out from the minimal hole 3 is detected and that the piercing is controlled based on the detection result of the flow rate of the fluid. Accordingly, the fluid injection quantity required for the minimal hole 3 can be secured, and also the highest possible improvement can be attained in the productivity. COPYRIGHT: (C)2004,JPO
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公开(公告)号:JP4069348B2
公开(公告)日:2008-04-02
申请号:JP2001046612
申请日:2001-02-22
Applicant: トヨタ自動車株式会社
Inventor: 裕彦 久野
Abstract: PROBLEM TO BE SOLVED: To provide a laser-beam-machining method and device of simple structure where a hole with an arbitrarily shaped peripheral wall, or the like can be easily accurately machined by laser beam machining and furthermore the machining can be three-dimensionally controllable according to the advanced depth of the machining. SOLUTION: A wedge board 1 capable of rotating around an irradiation optical axis BC1 and a beam condensing lens 2 as a beam condensing optical system capable of moving in the direction of the axis BC1 are arranged on the path of a laser beam LB1-LB3. A machining portion Wa is machined with a laser beam LD3 irradiated through a beam condensing lens 2 while rotating a laser beam LB2 in an eccentric state to the irradiating optical axis that is generated by rotating the wedge board 1 around the irradiating optical axis. The eccentric quantity and/or the focus of the laser beam LB3 is adjusted by moving a beam condensing system 2 along the irradiating optical axis BC1 with the advance of the machining.
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公开(公告)号:JP4386137B2
公开(公告)日:2009-12-16
申请号:JP2008051359
申请日:2008-02-29
Applicant: トヨタ自動車株式会社
CPC classification number: G02B26/101 , B23K26/064 , B23K26/082 , B23K26/389
Abstract: A laser processing apparatus 11 comprises a first shift mechanism 31 including a first transparent member 41 having a first incident face 43 and a first output face 44 that are parallel to each other; and a first motor 42 that rotates the first transparent member 41 around a first rotational axis; wherein the first shift mechanism 31 shifts the laser beam L exiting from the first output face 44 in a state parallel with the incident light on the first incident face 43 in a first direction. The laser processing apparatus 11 also comprises a second shift mechanism 32 including a second transparent member 46 including a second incident face 48 and a second output face 49 that are parallel to each other; and a second motor 47 that rotates the second transparent member 46 around the second rotational axis; wherein the second rotating mechanism 32 rotates the laser beam L exiting from the second output face 49 in a state parallel with the laser beam L incident on the second incident face 48 in a second direction perpendicular to the first direction. A light collecting lens 22 collects the laser beam L shifted with the second shift section 32 to process a work W1. This configuration allows control of a taper angle of a hole formed by laser processing.
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公开(公告)号:JP4246981B2
公开(公告)日:2009-04-02
申请号:JP2002272154
申请日:2002-09-18
Applicant: トヨタ自動車株式会社 , 株式会社ジェイテクト , 株式会社ジェネシア
Abstract: PROBLEM TO BE SOLVED: To provide a laser beam machine having enhanced resolution and capable of performing fine scanning easily. SOLUTION: A first refracting member 40x and a second refracting member 40y are movable according to the incoming angle and refractive index of laser beams so that the outgoing laser beams are almost parallel with the incoming laser beams. The first refracting member 40x can rotate, with a first rotation axis normal to the traveling direction of the laser beams being as the center. The second refracting member 40y can rotate, with a second rotation axis normal to the traveling direction of the laser beams and the first rotation axis being as the center. The incoming laser beams are condensed on a workpiece to be processed, with the use of a lens group comprising condensing lenses and/or divergent lenses. The first refracting member 40x and the second refracting member 40y are placed in either optical path where the laser beams are condensed or diverged by the optional lens or where the laser beams are diverged by the optional divergent lens. COPYRIGHT: (C)2004,JPO
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公开(公告)号:JP3597350B2
公开(公告)日:2004-12-08
申请号:JP24173897
申请日:1997-08-25
Applicant: トヨタ自動車株式会社 , 豊田工機株式会社
Abstract: PROBLEM TO BE SOLVED: To surely execute the welding having good quality by arranging a contact disk rotated in the advancing direction of a laser beam machining head while pressing the vicinity of the irradiated part with a laser beam on a work along a laser beam condensing angle. SOLUTION: The contact disk 7 rotated in the advancing direction of the laser beam machining head while pressing near the focus point 6 of a laser beam 5 to the work W, is supported with supporting legs 9 fixed to a holder 2 through supporting shafts 10. As the contact disk 7, a round disk cooted with molybdenum or a machined molybdenum round disk is suitable and the disk is disposed in a faced V-shape so as to interpose the laser beam 5 at the mutually different angles along the beam condensing angle of the laser beam 5. The pressing point 8 on the contact disk 7 to the work W is offset in the advancing direction of the laser beam machining head in a distance larger than the diameter of the focus point 6 of the laser beam 5 and the surrounding of the welding position with the laser beam is shielded with inert gas through a shield gas nozzle 11.
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