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    Heat exchanger, semiconductor device, and a method for their preparation
    1.
    发明专利
    Heat exchanger, semiconductor device, and a method for their preparation 有权

    公开(公告)号：JP5370481B2

    公开(公告)日：2013-12-18

    申请号：JP2011513139

    申请日：2009-05-11

    Applicant: トヨタ自動車株式会社

    Inventor： 正裕 森野 ,  靖治 竹綱 ,  栄作 垣内 ,  悠也 高野

    IPC: H01L23/473 ,  H05K7/20

    CPC classification number: H01L23/473 ,  H01L21/4882 ,  H01L2924/0002 ,  H05K7/20509 ,  H05K7/20918 ,  Y10T29/4935 ,  Y10T29/49375 ,  Y10T29/49384 ,  Y10T29/49393 ,  H01L2924/00

    Abstract: Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufacturing the heat exchanger, a semiconductor device wherein warping (bending) of an intervening member and a frame is suppressed, and a method for manufacturing the semiconductor device are also disclosed. Specifically disclosed is a heat exchanger (10) wherein a fin member (20) provided with a plurality of fins (22) forming flow channels (25) for a refrigerant is arranged within a frame (30) which forms the outer casing. The frame (30) has a first frame member (31) (a first wall portion) to which insulating plates (60) (intervening members) interposed between the frame (30) and heat-generating bodies (semiconductor elements (71-74)) are welded. The insulating plates (60) (intervening members) have a linear expansion coefficient different from that of the frame (30). The first frame member (31) is provided with elastically deformable projections (31b-31e) (elastically deformable portions) along an arrangement surface (31 g) of the outer surface (31f) on which the insulating plates (60) (intervening members) are arranged.

    冷却器
    3.
    发明专利
    冷却器 有权

    公开(公告)号：JPWO2012114475A1

    公开(公告)日：2014-07-07

    申请号：JP2011536675

    申请日：2011-02-23

    Applicant: トヨタ自動車株式会社

    Inventor： 悠也 高野 ,  悠也 高野

    IPC: H05K7/20 ,  H01L23/473 ,  H02M7/48

    CPC classification number: H05K7/20254 ,  F28D20/02 ,  F28F3/022 ,  F28F13/08 ,  H01L23/473 ,  H01L2924/0002 ,  Y02E60/145 ,  H01L2924/00

    Abstract: 冷却器(4)は、天板(10)と冷却ケース(30)との間に配置されているピンフィン(20)に対して冷媒(40)が流れるものである。冷却ケース(30)において冷媒(40)が流れる流れ方向に延びる側壁面(32)と、ピンフィン(20)において側壁面(32)に一番近い端部分(20a)との間の隙間(S1)で、流れ方向において冷媒(40)の直線状流れを防止する流動防止手段が設けられている。この流動防止手段は、冷却ケース(30)の側壁面(32)からこの側壁面(32)に垂直な方向に延びる突起(35)である。この突起(35)により、隙間(S1)で冷媒(40)の直線状流れが生じなくなり、ピンフィン(20)に当接して冷却機能を発揮する冷媒の流速が増加する。この結果、乱流が生じ易くなり、冷却性能が向上する。

    Heat exchanger
    4.
    发明专利
    Heat exchanger 有权

    公开(公告)号：JP5370467B2

    公开(公告)日：2013-12-18

    申请号：JP2011267687

    申请日：2011-12-07

    Applicant: トヨタ自動車株式会社

    Inventor： 正裕 森野 ,  靖治 竹綱 ,  栄作 垣内 ,  悠也 高野

    IPC: H01L23/36 ,  G01N23/04 ,  H01L23/40

    CPC classification number: H01L24/32 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To detect a void accurately by X-ray inspection even in the case of a heat exchanger equipped with a comb-type cooling fin and used in a power module. SOLUTION: The heat exchanger 1 of a power module 2 comprises a case 3, a comb-type cooling fin 4 housed in the case 3, and a heat spreader bonded to the upper surface of the case 3 with a bonding agent 10. An IGBT 6 is fixed to the upper surface of the heat spreader with the bonding agent 10. The cooling fin 4 has a plurality of fins 4d projecting obliquely in parallel from the lower surface of a planar base 4a with a gap 9 between one other. The plurality of fins 4d of the cooling fin 4 are arranged so that the distal end 4e of one fin 4d1 and the proximal end 4f of the other adjoining fin 4d2 have the same width W2, and overlap each other in the direction perpendicular to the upper and lower surfaces of the base 4a. COPYRIGHT: (C)2012,JPO&INPIT

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