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公开(公告)号：JP2011507271A
公开(公告)日：2011-03-03
申请号：JP2010537991
申请日：2008-12-12
发明人： コン・シン−チャン , ズー・ジ , スリニバサン・サティシュ , ペン・グラント , ポドレスニク・ドラガン , ムイ・デビッド・エス．エル． , メンディラッタ・アージュン
IPC分类号： H01L21/304
CPC分类号： C11D7/5009 , C11D3/3723 , C11D3/3765 , C11D3/3773 , C11D7/261 , C11D7/3263 , C11D7/34 , C11D11/0047 , H01L21/02057 , H01L21/67051 , Y10S134/902
摘要： The embodiments of the present invention provide improved materials for cleaning patterned substrates with fine features. The cleaning materials have advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network). The long polymer chains and/or polymer network show superior capabilities of capturing and entrapping contaminants, in comparison to conventional cleaning materials.
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公开(公告)号：JP5290321B2
公开(公告)日：2013-09-18
申请号：JP2010537987
申请日：2008-12-12
发明人： ムイ・デビッド・エス．エル． , スリニバサン・サティシュ , ペン・グラント , ズー・ジ , コン・シン−チャン , ポドレスニク・ドラガン , メンディラッタ・アージュン
IPC分类号： H01L21/304
CPC分类号： C11D7/5009 , C11D3/3723 , C11D3/3765 , C11D3/3773 , C11D7/261 , C11D7/3263 , C11D7/34 , C11D11/0047 , H01L21/02057 , H01L21/67051 , Y10S134/902
摘要： The embodiments of the present invention provide improved materials for cleaning patterned substrates with fine features. The cleaning materials have advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network). The long polymer chains and/or polymer network show superior capabilities of capturing and entrapping contaminants, in comparison to conventional cleaning materials.
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公开(公告)号：JP5398733B2
公开(公告)日：2014-01-29
申请号：JP2010537991
申请日：2008-12-12
发明人： ムイ・デビッド・エス．エル． , スリニバサン・サティシュ , ペン・グラント , ズー・ジ , コン・シン−チャン , ポドレスニク・ドラガン , メンディラッタ・アージュン
IPC分类号： H01L21/304
CPC分类号： C11D7/5009 , C11D3/3723 , C11D3/3765 , C11D3/3773 , C11D7/261 , C11D7/3263 , C11D7/34 , C11D11/0047 , H01L21/02057 , H01L21/67051 , Y10S134/902
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公开(公告)号：JP5398732B2
公开(公告)日：2014-01-29
申请号：JP2010537988
申请日：2008-12-12
发明人： ムイ・デビッド・エス．エル． , スリニバサン・サティシュ , ペン・グラント , ズー・ジ , コン・シン−チャン , ポドレスニク・ドラガン , メンディラッタ・アージュン
IPC分类号： H01L21/304
CPC分类号： C11D7/5009 , C11D3/3723 , C11D3/3765 , C11D3/3773 , C11D7/261 , C11D7/3263 , C11D7/34 , C11D11/0047 , H01L21/02057 , H01L21/67051 , Y10S134/902
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公开(公告)号：JP2011507279A
公开(公告)日：2011-03-03
申请号：JP2010538220
申请日：2008-12-14
发明人： ズー・ジ , ムイ・デビッド , メンディラッタ・アージュン
IPC分类号： H01L21/304
CPC分类号： C11D7/5009 , C11D3/3723 , C11D3/3765 , C11D3/3773 , C11D7/261 , C11D7/3263 , C11D7/34 , C11D11/0047 , H01L21/02057 , H01L21/67051 , Y10S134/902
摘要： The embodiments of the present invention provide improved materials for cleaning patterned substrates with fine features. The cleaning materials have advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network). The long polymer chains and/or polymer network show superior capabilities of capturing and entrapping contaminants, in comparison to conventional cleaning materials.
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公开(公告)号：JP5286367B2
公开(公告)日：2013-09-11
申请号：JP2010538220
申请日：2008-12-14
发明人： ズー・ジ , メンディラッタ・アージュン , ムイ・デビッド
IPC分类号： H01L21/304
CPC分类号： C11D7/5009 , C11D3/3723 , C11D3/3765 , C11D3/3773 , C11D7/261 , C11D7/3263 , C11D7/34 , C11D11/0047 , H01L21/02057 , H01L21/67051 , Y10S134/902
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公开(公告)号：JP2011507270A
公开(公告)日：2011-03-03
申请号：JP2010537988
申请日：2008-12-12
发明人： コン・シン−チャン , ズー・ジ , スリニバサン・サティシュ , ペン・グラント , ポドレスニク・ドラガン , ムイ・デビッド・エス．エル． , メンディラッタ・アージュン
IPC分类号： H01L21/304
CPC分类号： C11D7/5009 , C11D3/3723 , C11D3/3765 , C11D3/3773 , C11D7/261 , C11D7/3263 , C11D7/34 , C11D11/0047 , H01L21/02057 , H01L21/67051 , Y10S134/902
摘要： The embodiments of the present invention provide improved materials for cleaning patterned substrates with fine features. The cleaning materials have advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network). The long polymer chains and/or polymer network show superior capabilities of capturing and entrapping contaminants, in comparison to conventional cleaning materials.
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公开(公告)号：JP2011507269A
公开(公告)日：2011-03-03
申请号：JP2010537987
申请日：2008-12-12
发明人： コン・シン−チャン , ズー・ジ , スリニバサン・サティシュ , ペン・グラント , ポドレスニク・ドラガン , ムイ・デビッド・エス．エル． , メンディラッタ・アージュン
IPC分类号： H01L21/304
CPC分类号： C11D7/5009 , C11D3/3723 , C11D3/3765 , C11D3/3773 , C11D7/261 , C11D7/3263 , C11D7/34 , C11D11/0047 , H01L21/02057 , H01L21/67051 , Y10S134/902
摘要： The embodiments of the present invention provide improved materials for cleaning patterned substrates with fine features. The cleaning materials have advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network). The long polymer chains and/or polymer network show superior capabilities of capturing and entrapping contaminants, in comparison to conventional cleaning materials.
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