中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

7 records (took 0.016 seconds)

    Conductive rubber composition and office equipment rubber member
    4.
    发明专利
    Conductive rubber composition and office equipment rubber member 有权

    公开(公告)号：JP4348776B2

    公开(公告)日：2009-10-21

    申请号：JP15295099

    申请日：1999-05-31

    Applicant: Jsr株式会社

    Inventor： 清訓 喜多 ,  雅史 島影 ,  秀且 後藤 ,  正昭 高嶋

    IPC: C08L15/00 ,  G03G15/02 ,  C08K3/00 ,  C08L21/00 ,  F16C13/00 ,  G03G15/08 ,  G03G15/16

    Abstract: PROBLEM TO BE SOLVED: To provide a rubber composition which gives by vulcanization a low hard conductive rubber member excellent in electrical characteristics in respect of not only specified electrical resistance but also small variations with positions of electrical resistance and minor fluctuations in electrical resistance caused by environmental changes from a low temperature and low humidity condition to a high temperature and high humidity condition and the like and as well as excellent in compression set characteristics, and to provide also a rubber member for business equipment excellent in various properties above. SOLUTION: This conductive rubber composition [I] comprises 98-100 pts.wt. of a hydrogenated diene-based polymer (A), 2-90 pts.wt. of a rubber (B) different from the hydrogenated diene-based polymer (A), (A) and (B) adding up to 100 pts.wt., and an electroconductivity-imparting substance (C) and [II] has a seaisland structure wherein the hydrogenated diene-based polymer (A) forms an island phase and the rubber (B) different from the hydrogenated diene-based polymer (A) forms a sea phase, and [III] the electroconductivity-imparting substance (C) is maldistributed in the sea phase. A rubber member for business equipment is manufactured using the conductive rubber composition above.

    Chemical mechanical polishing pad
    6.
    实用新型
    Chemical mechanical polishing pad 失效

    公开(公告)号：JP3124046U

    公开(公告)日：2006-08-03

    申请号：JP2006003950

    申请日：2006-05-24

    Applicant: Jsr株式会社Jsr Corporation

    Inventor： 秀且 後藤 ,  勝孝 横井 ,  裕之 田野 ,  昭衛 辻

    IPC: H01L21/304 ,  B24B37/20

    Abstract: 【課題】パッドの交換作業の際、クリーンルーム内の作業環境下においても剥離層を容易に剥離しうる化学機械研磨パッドを提供すること。
    【解決手段】化学機械研磨パッドは、少なくとも研磨層、両面テープ層および剥離層が順次積層されてなり、剥離層が耳部を有する。 耳部は、好ましくは幅が２ｍｍ以上であり、耳部の長さが５ｍｍ以上である。 化学機械研磨パッドは、研磨層と両面テープ層の間に、更に支持層が積層されていてもよい。
    【選択図】図１

Patent Agency Ranking