Seal structure
    2.
    发明专利

    公开(公告)号:JP5348603B2

    公开(公告)日:2013-11-20

    申请号:JP2008025827

    申请日:2008-02-06

    Abstract: PROBLEM TO BE SOLVED: To provide a sealing structure which prevent the generation of rubber burr and disconnection of a printed wiring layer in integrally molding a sealing member on a flexible wiring board, and has excellent sealing performance and can be inexpensively manufactured. SOLUTION: The sealing structure comprises a housing for allowing the flexible wiring board 1 to be inserted, and the sealing member 3 integrally molded with the flexible wiring board 1 for sealing a gap between the housing and the flexible wiring board 1. A bonding sheet and an elastic material as an auxiliary material are disposed on the flexible wiring board 1 on at least one surface of a region of the flexible wiring board 1 where the sealing material 3 exists. COPYRIGHT: (C)2008,JPO&INPIT

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